
Data Sheet G14983EJ5V0DS
12
μPC2918, 2925, 2926
RECOMMENDED SOLDERING CONDITIONS
The
μ PC2918, 2925 and 2926 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Surface Mount Device
μ PC29xxT Series: SC-63 (MP-3Z)
Process
Conditions
Symbol
Infrared Ray Reflow
Peak temperature: 235
°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210
°C or higher),
Maximum number of reflow processes: 3 times or less.
IR35-00-3
Vapor Phase Soldering
Peak temperature: 215
°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200
°C or higher),
Maximum number of reflow processes: 3 times or less.
VP15-00-3
Partial Heating Method
Pin temperature: 350
°C or below,
Heat time: 3 seconds or less (Per each side of the device).
P350
μ PC29xxT-AZ Series
Note1, μPC29xxT-AY Series Note2: SC-63 (MP-3Z)
Process
Conditions
Symbol
Infrared Ray Reflow
Peak temperature: 260
°C or below (Package surface temperature),
Reflow time: 60 seconds or less (at 220
°C or higher),
Maximum number of reflow processes: 3 times or less.
IR60-00-3
Partial Heating Method
Pin temperature: 350
°C or below,
Heat time: 3 seconds or less (Per each side of the device).
P350
Notes 1. Pb-free (This product does not contain Pb in the external electrode.)
2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.)
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Remark Flux: Rosin-based flux with low chlorine content (chlorine 0.2 Wt% or below) is recommended.
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