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參數(shù)資料
| 型號： | UPC2726T-E3 |
| 元件分類： | 放大器 |
| 英文描述： | 2400 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | MINI MOLD, 6 PIN |
| 文件頁數(shù)： | 2/12頁 |
| 文件大?。?/td> | 143K |
| 代理商： | UPC2726T-E3 |
10
PPPPPC2726T
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to prevent an increase in ground impedance (which can cause
undesired oscillation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (having, for example, a capacitance of 1 000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions.
Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
PPC2726T
Soldering process
Soldering conditions
Recommended condition
symbols
Infrared ray reflow
Package peak temperature: 235 °C,
Hour: within 30 s. (more than 210 °C),
Time: 3 times, Limited days; no.*
IR35-00-3
VPS
Package peak temperature: 215 °C,
Hour: within 40 s. (more than 200 °C),
Time: 3 times, Limited days: no.*
VP15-00-3
Wave soldering
Soldering tub temperature: less than 260 °C,
Hour: within 10 s.
Time: 1 time, Limited days: no.
WS60-00-1
Pin part heating
Pin area temperature: less than 300 °C,
Hour: within 3 s.
Limited days: no.*
*: It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.
Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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