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參數(shù)資料
| 型號： | UPC2723T-E3 |
| 廠商： | NEC Corp. |
| 英文描述： | 1.1 GHz AGC AMPLIFIER FOR DBS TUNER AND MOBILE TELEPHONE |
| 中文描述： | 1.1 GHz的AGC放大器的DBS調(diào)諧和移動電話 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 178K |
| 代理商： | UPC2723T-E3 |
11
μ
PC2723T
NOTE ON CORRECT USE
(1)
(2)
(3)
(4)
Observe precautions for handling because of electro-static sensitive devices.
Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
Keep the wiring length of the ground pins as short as possible.
Connect a bypass capacitor (e.g. 1 000 pF) to the V
CC
pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than
the recommended conditions are to be consulted with our sales representatives.
μ
PC2723T
Soldering method
Infrared ray reflow
VPS
Wave soldering
Pin part heating
Soldering conditions
Package peak temperature: 235
°
C,
Hour: within 30 s. (more than 210
°
C),
Time: 2 times, Limited days: no.
*
Package peak temperature: 215
°
C,
Hour: within 40 s. (more than 200
°
C),
Time: 2 times, Limited days: no.
*
Soldering tub temperature: less than 260
°
C,
Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin area temperature: less than 300
°
C,
Hour: within 3 s/pin.
Limited days: no.
*
Recommended
condition symbol
IR35–00-2
VP15–00-2
WS60–00-1
*:
It is the storage days after opening a dry pack, the storage conditions are 25
°
C, less than 65 % RH.
Note 1.
The combined use of soldering method is to be avoided (However, except the pin area heating method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (IEI-1207).
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