參數(shù)資料
型號(hào): UPC2721GR
元件分類(lèi): 上/下變頻器
英文描述: RF/MICROWAVE DOWN CONVERTER, 7 dBm OUTPUT POWER-MAX
封裝: 225 mil, plastic sop-8
文件頁(yè)數(shù): 3/12頁(yè)
文件大小: 90K
代理商: UPC2721GR
Data Sheet P11102EJ4V0DS00
11
PC2721, PC2722
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales officers in case other soldering process is used or in case soldering is done under
different conditions.
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
PC2721/22
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 235
°C or below,
Reflow time: 30 seconds or below (210
°C or higher),
Number of reflow process: 3, Exposure limit
Note: None
IR35-00-3
VPS
Peak package’s surface temperature: 215
°C or below,
Reflow time: 40 seconds or below (200
°C or higher),
Number of reflow process: 3, Exposure limit
Note: None
VP15-00-3
Wave soldering
Solder temperature: 260
°C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit
Note: None
WS60-00-1
Partial heating method
Terminal temperature: 300
°C or below,
Flow time: 3 seconds or below,
Exposure limitNote: None
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25
°C and relative humidity at 65 % or less.
Caution Do not apply more than single process at once, except the “Partial heating method”.
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