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參數(shù)資料
| 型號： | UPC1892CT-02 |
| 廠商： | NEC Corp. |
| 英文描述： | MATRIX SURROUND SOUND PROCESSOR WITH SOUND PROCESSOR |
| 中文描述： | 矩陣環(huán)繞聲處理器，音頻處理器 |
| 文件頁數(shù)： | 40/42頁 |
| 文件大?。?/td> | 299K |
| 代理商： | UPC1892CT-02 |
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μ
PC1892
40
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
For more details, refer to our document
"SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (IEI-1207)
.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different
conditions.
Type of Through Hole Device
μ
PC1892CT
μ
PC1892CT-02 : 30-pin plastic shrink DIP (400 mil)
: 30-pin plastic shrink DIP (400 mil)
Soldering Process
Soldering Conditions
Solder temperature: 260
°
C or lower.
Flow time: 10 seconds or less.
Pin temperature: 260
°
C or lower.
Time: 10 seconds or less.
Wave Soldering (For leads only)
Partial Heating Method
Caution
Do not jet molten solder on the surface of package.
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