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Microsemi
580 Pleasant Street, Watertown, MA. 02472-2408, 617-926-0404, Fax: 617-924-1235
Page 1
Copyright
2002
Rev. 2., 2003-06-03
WWW
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UPBLEDLPxx
HIGH BRIGHTNESS BLUE LED
PRODUCT PREVIEW
The UPBLEDLPxx blue LED product series incorporates Microsemi’s unique,
low profile packaging concept. Ideally suited for high density circuitry used in a
variety of telecommunication lighting applications. The product offers robust
packaging, and low forward voltage for high efficiency as well as modest
junction temperature rise.
IMPORTANT: Forthemostcurrentdata,consultMICROSEMI’s website: http://www.microsemi.com
For operation of these LEDs in pulse mode applications, devices may be used in conjunction with
the Microsemi LX1992LED Drivers
ABSOLUTE MAXIMUM RATINGS AT 25 C
(UNLESS OTHERWISE SPECIFIED)
THERMAL CHARACTERISTICS
(UNLESS OTHERWIS E SP ECIFI E D)
Thermal Response
Symbol
Value
Units
Junction Temperature rise at 20ma dc
TJmx
15
°C
The first “x” of the postscript designates the Intensity bin , i.e. H highest, G lower, F lowest
The second “x” of the postscript designates the forward voltage category L, lowest, S, Standard
See pg. 2 for details.
Parameters
Symbol
Value
Unit
DC
Forward Drive Current
IF
30
mA
Peak Forward Current
IFP
100
mA
LED Operating Junction Temperature
Tj
-40 to +140
°C
Reverse Voltage
VR
8
V
Power Dissipation
PD
125
mW
Operating Temperature
TOPR
-40 to +125
°C
Storage Temperature
TS
-45 to +140
°C
Electrostatic Discharge
ESD
1000
V
ESD classification
Class 1
Solder Reflow Peak Temperature (Solder 10”)
225
°C
KEY FEATUR ES
Low profile (0.35mm;15mils)
Low Vf available (<3.0V @5mA)
Wide viewing angle
High brightness
Luminous Efficiency
Rugged Optomite package
APPLICATIONS/BENEFITS
Mobile Phone Keypad
Panel, button, switch indicators.
Backlighting
Signage
Signals and Marker Lights
UU
PP
BB
LL
EE
DD
LL
PP
XX