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參數(shù)資料
| 型號： | UCC5510MWP |
| 元件分類： | 運(yùn)動控制電子 |
| 英文描述： | Dual operational amplifier and voltage reference |
| 中文描述： | 終結(jié)者| BICMOS工藝|?？苵 36PIN |塑料 |
| 文件頁數(shù)： | 2/5頁 |
| 文件大?。?/td> | 47K |
| 代理商： | UCC5510MWP |
2
UC5510
L3+
HS/GND
L9–
L9+
L8–
TRMPWR
N/C
N/C
HS/GND
L2–
HS/GND
L1+
L1–
L2+
REG
HS/GND
L3–
L8+
HS/GND
HS/GND
L4+
L4–
14
13
12
11
10
9
8
7
6
5
4
3
2
1
23
24
25
26
27
28
29
30
31
32
33
34
35
36
18
17
16
15
DIFF B
MSTR/SLV
DIFFSENS
19
20
21
22
L5+
L5–
N/C
GND
L7–
L7+
L6–
L6+
N/C
N/C
N/C
CONNECTION DIAGRAM
SSOP-36 (Top View)
MWP Package
ELECTRICAL CHARACTERISTICS:
Unless otherwise specified, T
A
= 0°C to 70°C, TRMPWR = 3.3V.
PARAMETER
TRMPWR Supply Current Section
TRMPWR Supply Current
Disable Terminator, in DISCNCT mode.
Regulator Section
1.25V Regulator
LVD Mode
1.25V Regulator Source Current
LVD Mode, Differential Sense Floating
1.25V Regulator Sink Current
LVD Mode, Differential Sense Floating
1.3V Regulator
DIFFSENS
1.3V Regulator Source Current
DIFFSENS
1.3V Regulator Sink Current
DIFFSENS
2.7V Regulator
Single Ended Mode
2.7V Regulator Source Current
Single Ended Mode
2.7V Regulator Sink Current
Single Ended Mode
2.7V Regulator Dropout Voltage
V
TRMPWR
– (V
REG
– 3.0 Min)
TEST CONDITIONS
MIN
TYP
MAX
UNITS
20
35
mA
μ
A
1.15
–80
80
1.2
–5
50
2.5
–200
100
1.25
–100
100
1.3
1.35
V
mA
mA
V
mA
μ
A
V
mA
mA
mV
1.4
–15
200
3
–800
400
200
2.7
–400
200
ABSOLUTE MAXIMUM RATINGS
TRMPWR Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6V
Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . 0V to TRMPWR
Package Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . 2W
Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature. . . . . . . . . . . . . . . . . . . –55°C to +150°C
Lead Temperature (Soldering, 10sec.) . . . . . . . . . . . . . +300°C
RECOMMENDED OPERATING CONDITIONS
TRMPWR Voltage . . . . . . . . . . . . . . . . . . . . . . . 3.0V TO 5.25V
All voltages are with respect to pin 1. Currents are positive into,
negative out of the specified terminal. Consult Packaging Sec-
tion of the Databook for thermal limitations and considerations of
packages.
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