參數(shù)資料
型號(hào)： UBA2070
元件分類： 8位微控制器
英文描述： 8-bit MCU for automotive with 16 to 60 Kbyte Flash, ADC, CSS, 5 timers, SPI, SCI, I2C interface
中文描述： 600伏冷陰極鎮(zhèn)流器驅(qū)動(dòng)IC
文件頁(yè)數(shù)： 17/20頁(yè)
文件大?。?/td> 109K
代理商： UBA2070
2002 Oct 24
17
Philips Semiconductors
Product specification
600 V CCFL ballast driver IC
UBA2070
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
7.
MOUNTING
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
DIPPING
suitable
suitable
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Surface mount
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
PLCC
(5)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
(3)
suitable
not suitable
(4)
suitable
not recommended
(5)(6)
not recommended
(7)
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UBA2070P 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:600 V CCFL ballast driver IC
UBA2070P/N1,112 功能描述:顯示驅(qū)動(dòng)器和控制器 CCFL RoHS:否 制造商:Panasonic Electronic Components 工作電源電壓:2.7 V to 5.5 V 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Reel
UBA2070T 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:600 V CCFL ballast driver IC
UBA2070T/N1,518 功能描述:顯示驅(qū)動(dòng)器和控制器 IC CCFL DRIVER RoHS:否 制造商:Panasonic Electronic Components 工作電源電壓:2.7 V to 5.5 V 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Reel
UBA2070TD-T 功能描述:IC CCFL DRIVER CONTROLLER 16SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 照明，鎮(zhèn)流器控制器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 類型:CCFL 控制器 頻率:40 ~ 80 kHz 電流 - 電源:5mA 電流 - 輸出:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) 其它名稱:90-3991V+V01
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