參數(shù)資料
型號(hào): UAA2082H
廠商: NXP SEMICONDUCTORS
元件分類(lèi): 尋呼電路
英文描述: Advanced pager receiver
中文描述: TELECOM, PAGING RECEIVER, PQFP32
封裝: 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, SOT-358-1, LQFP-32
文件頁(yè)數(shù): 14/40頁(yè)
文件大?。?/td> 457K
代理商: UAA2082H
1996 Jan 15
14
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
See Table 4 for bonding pad description and locations for x/y co-ordinates.
Fig.8 Bonding pad locations.
Chip area: 18.15 mm
2
Chip thickness: 380
±
20
μ
m.
Drawing not to scale.
handbook, full pagewidth
MLC229
28
1
2
3
4
5
6
7
8
9
10
11
UAA2082U
3.83
mm
4.74 mm
00
y
x
24
23
22
21
20
19
18
17
16
15
14
13
12
27
26
25
Where:
Pad number 1 (diameter 124 m)
Pad 124 m x 124 m
Pad not used
Pad 100 m x 100 m
Pad 100 m x 100 m with reference point
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