
1995 Dec 13
10
Philips Semiconductors
Product specification
2 GHz image rejecting front-end
UAA2077BM
Notes
1.
2.
3.
4.
Measured and guaranteed only on UAA2077BM demonstration board at T
amb
= +25
°
C.
Measured and guaranteed only on UAA2077BM demonstration board.
This value includes printed-circuit board and balun losses.
Measured and guaranteed only on UAA2077BM demonstration board at T
amb
= +25
°
C, with a 4.7 k
resistor
connected between V
QUADLO
and V
CC
.
RL
iLO
return loss on matched input
(including standby mode)
return loss variation between
SX, SRX and STX modes
LO input power level
reverse isolation
note 1
9
12
dB
RL
iLO
linear S
11
variation; note 1
5
mU
P
iLO
RI
LO
6
40
3
+3
dBm
dB
LOIN to RFIN at LO frequency;
note 1
connected between V
QUADLO
and
V
CC
R
tune
image rejection tuning resistor
0
4.7
k
Transmit section (transmit section enabled)
Z
LTX
RL
oTX
TX IF typical load impedance
return loss on matched TX IF
output
TX RF input resistance
(real part of the parallel input
impedance)
TX RF input capacitance
(imaginary part of the parallel
input impedance)
TX input frequency
return loss on matched TX input note 1
conversion power gain
balanced
note 1
11
500
15
dB
R
iTX
balanced; at 1750 MHz
65
C
iTX
balanced; at 1750 MHz
1
pF
f
iTX
RL
iTX
G
CPTX
1600
10
6
15
9
2000
12
MHz
dB
dB
differential transmitter inputs to
differential transmitter IF outputs
loaded with 500
differential
f
oTX
CP1
TX
IP2
TX
IP3
TX
NF
TX
I
TX
RI
TX
TX output frequency
1 dB input compression point
2nd-order intercept point
3rd-order intercept point
noise figure
isolation
reverse isolation
50
25
20
40
40
22
+22
16
5
400
9
MHz
dBm
dBm
dBm
dB
dB
dB
note 2
note 2
note 2
double sideband; notes 2 and 3
LOIN to TXIN; note 1
TXIN to LOIN; note 1
Timing
t
stu
start-up time of each block
1
5
20
μ
s
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT