- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382701 > TZA3041BHL (NXP SEMICONDUCTORS) Gigabit Ethernet/Fibre Channel laser drivers PDF資料下載
參數(shù)資料
| 型號(hào)： | TZA3041BHL |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 其它接口 |
| 英文描述： | Gigabit Ethernet/Fibre Channel laser drivers |
| 中文描述： | SPECIALTY INTERFACE CIRCUIT, PQFP32 |
| 封裝： | 5 X 5 X 1.40 MM, PLASTIC, LQFP-32 |
| 文件頁數(shù)： | 27/32頁 |
| 文件大?。?/td> | 153K |
| 代理商： | TZA3041BHL |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁當(dāng)前第27頁第28頁第29頁第30頁第31頁第32頁
2002 Aug 13
27
Philips Semiconductors
Product specification
Gigabit Ethernet/Fibre Channel laser
drivers
TZA3041AHL; TZA3041BHL;
TZA3041U
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TZA3041U | Gigabit Ethernet/Fibre Channel laser drivers |
| U-30-WCAB | High speed dual comparators |
| U-60-PP | Low power quad operational amplifiers |
| U05GU4B48 | SILICON DIFFUSED JUNCTION TYPE RECTIFIER STACK |
| U143M | 7-Segment Decoder Driver |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TZA3041U | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Gigabit Ethernet/Fibre Channel laser drivers |
| TZA3043 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Gigabit Ethernet/Fibre Channel transimpedance amplifier |
| TZA3043B | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Gigabit Ethernet/Fibre Channel transimpedance amplifier |
| TZA3043BT | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Gigabit Ethernet/Fibre Channel transimpedance amplifier |
| TZA3043BU | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Gigabit Ethernet/Fibre Channel transimpedance amplifier |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。