參數(shù)資料
型號(hào)： TZA3034TT
廠商： NXP SEMICONDUCTORS
元件分類： 數(shù)字傳輸電路
英文描述： SDH/SONET STM1/OC3 postamplifier
中文描述： ATM/SONET/SDH SUPPORT CIRCUIT, PDSO16
封裝： PLASTIC, TSSOP-16
文件頁數(shù)： 10/28頁
文件大?。?/td> 143K
代理商： TZA3034TT
1999 Nov 03
10
Philips Semiconductors
Product specification
SDH/SONET STM1/OC3 postamplifier
TZA3034
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134.
HANDLING
This device is ESD sensitive and should be handled with care. Precautions should be taken to avoid damage through
electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can
be obtained by bonding the V
CC
and GND pads first, the remaining pads may then be bonded to their external
connections in any order.
THERMAL CHARACTERISTICS
Note
1.
Thermal resistance from junction to ambient is determined with the IC soldered on a standard single-sided
57
×
57
×
1.6 mm FR4 epoxy printed-circuit board with 35
μ
m thick copper traces. The measurements are performed
in still air.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
CC
V
n
supply voltage
DC voltage
pins DIN, DINQ, CF, JAM and RSET
pins STQ, ST, DOUTQ and DOUT
pin V
ref
DC current
pins DIN, DINQ, CF and JAM
pins STQ, ST, DOUTQ and DOUT
pin V
ref
pin RSET
total power dissipation
storage temperature
junction temperature
ambient temperature
0.5
+6
V
0.5
V
CC
2
0.5
V
CC
+ 0.5
V
CC
+ 0.5
+3.2
V
V
V
I
n
1
25
2
2
65
40
+1
+10
+2.5
+2
300
+150
150
+85
mA
mA
mA
mA
mW
°
C
°
C
°
C
P
tot
T
stg
T
j
T
amb
SYMBOL
PARAMETER
CONDITION
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient note 1
SO16 package
TSSOP16 package
115
150
K/W
K/W
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