參數(shù)資料
型號(hào)： TZA1026
廠商： NXP Semiconductors N.V.
英文描述： Data amplifier and laser supply circuit for CD audio and video optical systems ((ADALASAuto)(應(yīng)用在CD音頻和視頻光學(xué)系統(tǒng)中的數(shù)據(jù)放大器和激光電源電路)
中文描述： 數(shù)據(jù)放大器和激光CD音頻和視頻（（ADALASAuto）（應(yīng)用在CD光學(xué)系統(tǒng)的供電線路音頻和視頻光學(xué)系統(tǒng)中的數(shù)據(jù)放大器和激光電源電路）
文件頁(yè)數(shù)： 7/20頁(yè)
文件大?。?/td> 134K
代理商： TZA1026
1998 Oct 30
15
Philips Semiconductors
Product specication
Data amplier and laser supply circuit for CD
audio and video optical systems (ADALASAuto)
TZA1026
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Reow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
°C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
°C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°C within
6 seconds. Typical dwell time is 4 seconds at 250
°C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°C.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TZA1026T 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Data amplifier and laser supply circuit for CD audio and video optical systems ADALASAuto
TZA1026T/V2,118 功能描述:IC DATA AMPLIFIER 14-SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類(lèi)型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類(lèi)型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝
TZA1027 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Analog current buffer for CD-R and CD-RW systems
TZA1027HL 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Analog current buffer for CD-R and CD-RW systems
TZA1032 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Laser driver and controller circuit
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