(3) Reflow Soldering
TZS02 / TZVY2 / TZVX2 / TZV02 / TZC03 / TZBX4 series
Refer to the standard temperature profile listed below.
20
No.T13E4.pdf 99.8.23
This is the PDF file of catalog No.T13E-4.
Notice of Ceramic Trimmer Capacitor
200
250
100
0
Pre-heating (in air)
Gradual Cooling
(in air)
Solderring
T
e
m
p
e
ra
tu
re
(D
)
5 sec. max.
60
Y120 sec.
230
183
100
0
20 sec. max.
60
Y120 sec.
(Solder Melting Zone)
Pre-heating (in air)
Gradual Cooling
(in air)
Solderring
T
e
m
p
e
ra
tu
re
(D
)
Flow Soldering
Reflow Soldering
Introduction :
Trimmer capacitors made by MURATA MFG. CO., LTD. are
designed to achieve high reliability and cost
efficiency. We offer the following usage guidelines
to ensure our trimmer capacitors perform effectively
and meet your requirements. Rapid innovations will
certainly create new applications for our trimmer
capacitors. We welcome you to contact us
concerning application questions.
1. Mounting Trimmer Capacitors on PCBs
(1) Ensure that PCB hole spacing complies with the terminal
spacing requirement of the intended trimmer capacitor
model. Incorrect hole spacing may lower trimmer capacitor
performance due to excessive stress applied to the
terminal.
(2) Mount trimmer capacitor in contact with PCB.
(3) Do not apply bending stress after the trimmer capacitor
has been mounted to the PCB. See the stress
specification listed below.
(4) Note trimmer capacitor polarity to minimize the influence of
stray capacitance. Refer to the outlines of each model.
(
W Terminal:Stator side ; Y Terminal:Rotor side)
(5) Do not warp and/or bend PC board to prevent trimmer
capacitor from breakage.
2. Soldering
Standard soldering conditions are shown below.
Before using soldering conditions other than those
listed below , please consult MURATA factory
representative. If the soldering conditions are not
suitable for the product , the trimmer capacitor may
deviate from the specified performances characteristic.
(1) Soldering Iron
(2) Flow Soldering
TZBX4 Cover film type
Immerse the body in solder bath
TZBX4 Terminal style C and D / TZ03 series
Only immerse terminal in solder bath
Refer to the standard temperature profile listed below.
Tip temperature
Soldering time
Tip diameter
Iron wattage
260
DT10D
3 sec. max.
2mm dia. max.
30W max.
TZBX4/TZ03
260
DT10D
3 sec. max.
1mm dia. max.
20W max.
TZS02/TZVY2/
TZVX2/TZV02/TZC03
Model
TZ03/TZBX4 (Terminal Style CZD)
10.0N(Ref.1kgf)
Allowable Stress
(4) Notice When Soldering
The solder iron should contact neither the trimmer
capacitor's resin case nor its ceramic substrate.
To prevent the deterioration of trimmer capacitor
characteristics, apply flux only to terminals.
The amount of solder is critical. Insufficient amounts of
solder can lead to insufficient soldering strength on the
PCB. Excessive amounts of solder may cause bridging
between the terminals resulting in terminal shorts.
Do not use water - soluble flux if using water for washing.
TZS02 / TZVY2 / TZVX2 / TZV02 / TZC03 / TZBX4 series
without cover films can not be soldered using the flow
soldering method (dipping).
TZ03 series can not be soldered using the reflow soldering
method.
When soldering the TZC03 series, the solder should not
flow into the staking part of the substrate. If such flow does
occur, driver slot rotation will be impeded.
Use our standard land dimension. Excessive land area
causes displacement due to effect of the surface tension
of the solder or the contact failure due to flux wicking up.
Insufficient land area causes insufficient soldering strength
of the chip.
Series
TZS02/TZVY2/TZVX2/TZV02
TZC03
TZBX4
120
Y170m
150
Y200m
200
Y250m
Standard applying thickness