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參數(shù)資料
| 型號： | TVP5147PFPG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 顏色信號轉換 |
| 英文描述： | COLOR SIGNAL DECODER, PQFP80 |
| 封裝： | GREEN, PLASTIC, HTQFP-80 |
| 文件頁數(shù)： | 97/100頁 |
| 文件大?。?/td> | 1475K |
| 代理商： | TVP5147PFPG4 |
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Application Information
88
SLES099C—March 2007
TVP5147PFP
5.2
Designing With PowerPAD
t Devices
The TVP5147 device is housed in a high-performance, thermally enhanced, 80-terminal PowerPAD package
(TI package designator: 80PFP). Use of the PowerPAD package does not require any special considerations
except to note that the thermal pad, which is an exposed die pad on the bottom of the device, is a metallic
thermal and electrical conductor. Therefore, if not implementing the PowerPAD PCB features, the use of solder
masks (or other assembly techniques) can be required to prevent any inadvertent shorting by the exposed
thermal pad of connection etches or vias under the package. The recommended option, however, is not to run
any etches or signal vias under the device, but to have only a grounded thermal land as in the following
explanation. Although the actual size of the exposed die pad may vary, the minimum size required for the
keep-out area for the 80-terminal PFP PowerPAD package is 8 mm
× 8 mm.
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the
PowerPAD package. The thermal land varies in size, depending on the PowerPAD package being used, the
PCB construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may
not contain numerous thermal vias depending on PCB construction.
Other requirements for using thermal lands and thermal vias are detailed in the TI application note
PowerPAD
t Thermally Enhanced Package Application Report, (SLMA002), available via the TI Web pages
beginning at URL: http://www.ti.com
For the TVP5147 device, this thermal land must be grounded to the low-impedance ground plane of the
device. This improves not only thermal performance but also the electrical grounding of the device. It is also
recommended that the device ground terminal landing pads be connected directly to the grounded thermal
land. The land size must be as large as possible without shorting device signal terminals. The thermal land
can be soldered to the exposed thermal pad using standard reflow soldering techniques.
While the thermal land can be electrically floated and configured to remove heat to an external heat sink, it
is recommended that the thermal land be connected to the low-impedance ground plane for the device. More
information can be obtained from the TI application note PHY Layout (SLLA020).
PowerPAD is a trademark of Texas Instruments.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TVP5147PFPR | 功能描述:視頻 IC 10B Hi Qual Sgl-Chip Dig Vid Dec RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel |
| TVP5147PFPRG4 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:NTSC/PAL/SECAM 2x10-Bit Digital Video Decoder With Macrovision⑩ Detection,YPbPr Inputs,and 5-Line Comb Filter |
| TVP5150 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:LOW POWER VIDEO DECODER WITH SCALING |
| TVP5150A | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Ultralow Power NTSC/PAL/SECAM Video Decoder With Robust Sync Detector |
| TVP5150AEVM | 功能描述:視頻 IC 開發(fā)工具 Video Decoder Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Boards 類型:YPbPr to RGBHV Converters 工具用于評估:LMH1251 工作電源電壓:5 V |
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