參數(shù)資料
型號： TSC87251G2D-L16CED
廠商： ATMEL CORP
元件分類： 微控制器/微處理器
英文描述： B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
中文描述： 16-BIT, OTPROM, 16 MHz, MICROCONTROLLER, PQFP44
封裝： 10 X 10 MM, PLASTIC, VQFP-44
文件頁數(shù)： 21/28頁
文件大小： 153K
代理商： TSC87251G2D-L16CED
Qualpack TSC87251G2D
Rev. 0 – October 1999
21
Comments:
No reject observed during package qualification tests.
One reject in LFR, but physical analysis demonstrated the failure was wafer process dependant and not
related to the device itself. As a consequence it was not charged for device qualification.
3.5.1 Failure Mechanisms and Corrective Actions
As part of TEMIC continuous improvement policy, all defects are analysed. For all failure mechanisms
identified, root causes ranked regards number of occurencies and criticity are investigated and
addressed by corrective actions.
Failure
Mechanism
56% Contacts
misalignment
Root Cause
Corrective Action
Date
Effect
Check of
Efficiency
Visual inspection,
yield - 07/99
RTA drift
Upgrade of RTA
equipment
06/99
reduce alignment
scattering
26% Poly defects
Defect
density at
Poly level
# Hard mask :
replacement of PR
Titane mask by masking
buffers during Ti
deposition for
# polysilicideBARC
(Bottom Anti-Reflective
Coating)
# PR strip optimization
10/98
03/99
Reduction of
defect density at
Poly level
Improve Poly
dimension control
Defect density
reduction
Yield
EFR - 12/98
Yield
EFR - 12/98
EFR - 05/99
6% Metal particles
PR strip
process
# PR strip method
optimized
# Equipment upgrade
(Semitool)
03/99
07/99
Reduction of the
defect density
Yield – EFR 05/99
6% Passivation
Marginal
6% Silicon
breakdown
Marginal
3.5.2 Qualification status
The 0.5um logic wafer process was qualified on 1997 September. The qualification was extended to
OTP microcontrollers (SCMOS3 NV) process on 1999 April.
The TSC83251G2D was qualified on 1999 January, and OTP version TSC87251G2D was full qualified
on 1999 April.
相關PDF資料
PDF描述
TSC87251G2D-L16CB B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
TSC83251G2D-L16CB B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
TSC83251G2D-L16CED B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
TSC87251G2D B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
TSC87251G2D-16CB B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
相關代理商/技術參數(shù)
參數(shù)描述
TSC87251G2D-L16CER 功能描述:IC MCU 8BIT 32K OTP 16MHZ 44VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:8x251 標準包裝:1,500 系列:AVR® ATtiny 核心處理器:AVR 芯體尺寸:8-位 速度:16MHz 連通性:I²C，LIN，SPI，UART/USART，USI 外圍設備:欠壓檢測/復位，POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):16 程序存儲器容量:8KB（4K x 16） 程序存儲器類型:閃存 EEPROM 大小:512 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉換器:A/D 11x10b 振蕩器型:內部 工作溫度:-40°C ~ 125°C 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 包裝:帶卷 (TR)
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TSC873CW RPG 功能描述:兩極晶體管 - BJT NPN Silicon Planar Med Power Transistor RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2
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TSC888BILT 功能描述:電流靈敏放大器 Sense Amplifier 50 Gain RoHS:否 制造商:Texas Instruments 通道數(shù)量: 共模抑制比（最小值）:110 dB 輸入補償電壓:80 uV 電源電壓-最大:5.5 V 電源電壓-最小:2.7 V 電源電流:350 uA 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-16 封裝:Reel
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