
Qualpack TSC87251G2D
20 Rev 0 – October 1999
3.4 Package Qualification
This section summarizes the initial package qualification data of TSC87251G2D and TSC87251G2D
products in PLCC44.
Lots
Device Type
Test Description
Step
Result Comment
85/85 Humidity
500h
1000h
L1
0/50
0/50
0/10
Moisture Sensitivity
Ranking
HAST after Soldering
Stress
Thermal Cycles
Pass level 1 of J-20-STD
Z27314A
TSC87251G2D
PLCC44
15c
168h
500c
1000c
15c
168h
0/50
0/50
0/50
0/50
0/50
0/50
Z27746A
TSC83251G2D
PLCC44
HAST after Soldering
Stress
3.5 Device Qualification
This section presents the qualification results of TSC87251G2D/TSC83251G2D devices.
Lots
Device Type
Test Description
Step
Result Comment
EFR Dynamic Life Test
12h
24h
168h
500h
1000h
500h
1000h
12h
24h
168h
500h
1000h
2/1978
0/360
0/150
1/150
Interlayer oxide defect
Polysilicide particle
LFR Life Test
Metal 2 photo etch bridging
Z27314A
TSC87251G2D
PLCC44
High Temp. Retention
0/50
0/50
3/2661
0/211
0/100
0/100
0/100
EFR Dynamic Life Test
Polysilicide particle
Metal 3 defect
Z27746A
TSC83251G2D
PLCC44
LFR Life Test
Lots
Device Type
Test Description
Step
Result Comment
ESD HBM
2000V
3/3
Class 1 of MIL883
Z26629
TSC87251G2D
Latch up
Overvoltage
Power injection
ESD HBM
10V
50mW
2000V
3000V
0/5
0/5
0/3
0/3
Latch-up free
Class 2 of MIL883
Z27746
TSC83251G2D
Latch up
Overvoltage
Power injection
10V
50mW
0/5
0/5
Latch-up free