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    參數(shù)資料
    型號(hào): TS87C51RD2-VIL
    廠商: Atmel
    文件頁數(shù): 12/84頁
    文件大?。?/td> 0K
    描述: IC MCU 8051 OTP 64K 5V 68PLCC
    標(biāo)準(zhǔn)包裝: 19
    系列: 87C
    核心處理器: 8051
    芯體尺寸: 8-位
    速度: 40/30MHz
    連通性: UART/USART
    外圍設(shè)備: POR,PWM,WDT
    輸入/輸出數(shù): 48
    程序存儲(chǔ)器容量: 64KB(64K x 8)
    程序存儲(chǔ)器類型: OTP
    RAM 容量: 1K x 8
    電壓 - 電源 (Vcc/Vdd): 4.5 V ~ 5.5 V
    振蕩器型: 內(nèi)部
    工作溫度: -40°C ~ 85°C
    封裝/外殼: 68-PLCC
    包裝: 管件
    2007-2012 Microchip Technology Inc.
    DS70292G-page 21
    dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
    2.5
    ICSP Pins
    The PGECx and PGEDx pins are used for In-Circuit
    Serial Programming (ICSP) and debugging pur-
    poses. It is recommended to keep the trace length
    between the ICSP connector and the ICSP pins on the
    device as short as possible. If the ICSP connector is
    expected to experience an ESD event, a series resistor
    is recommended, with the value in the range of a few
    tens of Ohms, not to exceed 100 Ohms.
    Pull-up resistors, series diodes, and capacitors on the
    PGECx and PGEDx pins are not recommended as they
    will interfere with the programmer/debugger communi-
    cations to the device. If such discrete components are
    an application requirement, they should be removed
    from the circuit during programming and debugging.
    Alternatively, refer to the AC/DC characteristics and
    timing requirements information in the respective
    device Flash programming specification for information
    on capacitive loading limits and pin input voltage high
    (VIH) and input low (VIL) requirements.
    Ensure that the “Communication Channel Select” (i.e.,
    PGECx/PGEDx pins) programmed into the device
    matches the physical connections for the ICSP to
    MPLAB ICD 3 or MPLAB REAL ICE.
    For more information on ICD 3 and REAL ICE
    connection requirements, refer to the following
    documents that are available on the Microchip website.
    “Using MPLAB ICD 3 In-Circuit Debugger”
    (poster) DS51765
    “MPLAB ICD 3 Design Advisory” DS51764
    “MPLAB REAL ICE In-Circuit Emulator User’s
    Guide” DS51616
    “Using MPLAB REAL ICE” (poster) DS51749
    2.6
    External Oscillator Pins
    Many DSCs have options for at least two oscillators: a
    high-frequency primary oscillator and a low-frequency
    secondary oscillator (refer to Section 9.0 “Oscillator
    Configuration” for details).
    The oscillator circuit should be placed on the same
    side of the board as the device. Also, place the
    oscillator circuit close to the respective oscillator pins,
    not exceeding one-half inch (12 mm) distance
    between them. The load capacitors should be placed
    next to the oscillator itself, on the same side of the
    board. Use a grounded copper pour around the
    oscillator circuit to isolate them from surrounding
    circuits. The grounded copper pour should be routed
    directly to the MCU ground. Do not run any signal
    traces or power traces inside the ground pour. Also, if
    using a two-sided board, avoid any traces on the
    other side of the board where the crystal is placed. A
    suggested
    layout
    is
    shown
    in
    Recommendations
    for
    crystals
    and
    ceramic
    resonators are provided in Table 2-1 and Table 2-2,
    respectively.
    FIGURE 2-3:
    SUGGESTED PLACEMENT
    OF THE OSCILLATOR
    CIRCUIT
    TABLE 2-1:
    CRYSTAL RECOMMENDATIONS
    13
    Main Oscillator
    Guard Ring
    Guard Trace
    Secondary
    Oscillator
    14
    15
    16
    17
    18
    19
    20
    Part
    Number
    Vendor
    Freq.
    Load
    Cap.
    Package
    Case
    Frequency
    Tolerance
    Mounting
    Type
    Operating
    Temperature
    ECS-40-20-4DN
    ECS Inc.
    4 MHz
    20 pF
    HC49/US
    ±30 ppm
    TH
    -40°C to +85°C
    ECS-80-18-4DN
    ECS Inc.
    8 MHz
    18 pF
    HC49/US
    ±30 ppm
    TH
    -40°C to +85°C
    ECS-100-18-4-DN
    ECS Inc.
    10 MHz
    18 pF
    HC49/US
    ±30 ppm
    TH
    -40°C to +85°C
    ECS-200-20-4DN
    ECS Inc.
    20 MHz
    20 pF
    HC49/US
    ±30 ppm
    TH
    -40°C to +85°C
    ECS-40-20-5G3XDS-TR
    ECS Inc.
    4 MHz
    20 pF
    HC49/US
    ±30 ppm
    SM
    -40°C to +125°C
    ECS-80-20-5G3XDS-TR
    ECS Inc.
    8 MHz
    20 pF
    HC49/US
    ±30 ppm
    SM
    -40°C to +125°C
    ECS-100-20-5G3XDS-TR ECS Inc.
    10 MHz
    20 pF
    HC49/US
    ±30 ppm
    SM
    -40°C to +125°C
    ECS-200-20-5G3XDS-TR ECS Inc.
    20 MHz
    20 pF
    HC49/US
    ±30 ppm
    SM
    -40°C to 125°C
    NX3225SA 20MHZ AT-W NDK
    20 MHz
    8 pF
    3.2 mm x 2.5 mm
    ±50 ppm
    SM
    -40°C to 125°C
    Legend:
    TH = Through Hole
    SM = Surface Mount
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