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  • 參數(shù)資料
    型號(hào): TS8387VF
    元件分類: ADC
    英文描述: 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68
    封裝: CERAMIC, QFP-68
    文件頁(yè)數(shù): 7/38頁(yè)
    文件大?。?/td> 617K
    代理商: TS8387VF
    TS8387
    15/38
    4.4.
    THERMAL CHARACTERISTICS
    Although the power dissipation is low for this performance, the use of an heat sink is mandatory.
    You will find here below some advise on this topics.
    HThermal resistance – junction to ambient
    Air flow
    ja Thermal resistance
    °C/Watt
    CQFP 68 on board
    Air flow
    speed m/s
    Estimated
    Targeted
    No heatsink
    With heatsink
    24 x 24 x 16 mm
    0
    50
    33
    0.5
    40
    18
    1
    35
    14
    1.5
    32
    12
    2
    30
    11
    2.5
    28
    10
    3
    26
    10
    4
    24
    9
    5
    23
    8
    Heatsink glued to backside of package
    or pressed with thermal grease
    0
    10
    20
    30
    40
    50
    60
    01
    23
    4
    5
    6
    RTH ja estimated value for CQFP68 / without heatsink
    + targeted value CQFP68 with external heatsink
    Thermal
    resistance
    junction
    to
    air
    (degree
    C/Watt)
    Air flow speed (m/s)
    Without Heatsink
    24 x 24 x 16 mm heatsink
    HThermal resistance – junction to case :
    Rthjc = 6
    ° C/W (typical value).
    . . .
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