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參數(shù)資料

型號：	TS80C51RA2-MIE
廠商：	Atmel
文件頁數(shù)：	9/84頁
文件大?。?/td>	0K
描述：	IC MCU 8BIT 256BYTE 40MHZ 44VQFP
標準包裝：	160
系列：	80C
核心處理器：	8051
芯體尺寸：	8-位
速度：	40/20MHz
連通性：	UART/USART
外圍設備：	POR，PWM，WDT
輸入/輸出數(shù)：	32
程序存儲器類型：	ROMless
RAM 容量：	256 x 8
電壓 - 電源 (Vcc/Vdd)：	4.5 V ~ 5.5 V
振蕩器型：	內部
工作溫度：	-40°C ~ 85°C
封裝/外殼：	44-QFP
包裝：	托盤

2007-2012 Microchip Technology Inc.

DS70292G-page 19

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04

2.0

GUIDELINES FOR GETTING

STARTED WITH 16-BIT

DIGITAL SIGNAL

CONTROLLERS

2.1

Basic Connection Requirements

Getting started with the dsPIC33FJ32GP302/304,

dsPIC33FJ64GPX02/X04, and dsPIC33FJ128GPX02/

X04 family of 16-bit Digital Signal Controllers (DSCs)

requires attention to a minimal set of device pin

connections before proceeding with development. The

following is a list of pin names, which must always be

connected:

All VDD and VSS pins

(see Section 2.2 “Decoupling Capacitors”)

All AVDD and AVSS pins (regardless if ADC module

is not used)

(see Section 2.2 “Decoupling Capacitors”)

VCAP

(see Section 2.3 “CPU Logic Filter Capacitor

Connection (VCAP)”)

MCLR pin

(see Section 2.4 “Master Clear (MCLR) Pin”)

PGECx/PGEDx pins used for In-Circuit Serial

Programming (ICSP) and debugging purposes

(see Section 2.5 “ICSP Pins”)

OSC1 and OSC2 pins when external oscillator

source is used

(see Section 2.6 “External Oscillator Pins”)

Additionally, the following pins may be required:

VREF+/VREF- pins used when external voltage

reference for ADC module is implemented

2.2

Decoupling Capacitors

The use of decoupling capacitors on every pair of

power supply pins, such as VDD, VSS, AVDD and

AVSS is required.

Consider the following criteria when using decoupling

capacitors:

Value and type of capacitor: Recommendation

of 0.1 F (100 nF), 10-20V. This capacitor should

be a low-ESR and have resonance frequency in

the range of 20 MHz and higher. It is

recommended that ceramic capacitors be used.

Placement on the printed circuit board: The

decoupling capacitors should be placed as close

to the pins as possible. It is recommended to

place the capacitors on the same side of the

board as the device. If space is constricted, the

capacitor can be placed on another layer on the

PCB using a via; however, ensure that the trace

length from the pin to the capacitor is within

one-quarter inch (6 mm) in length.

Handling high frequency noise: If the board is

experiencing high frequency noise, upward of

tens of MHz, add a second ceramic-type capacitor

in parallel to the above described decoupling

capacitor. The value of the second capacitor can

be in the range of 0.01 F to 0.001 F. Place this

second capacitor next to the primary decoupling

capacitor. In high-speed circuit designs, consider

implementing a decade pair of capacitances as

close to the power and ground pins as possible.

For example, 0.1 F in parallel with 0.001 F.

Maximizing performance: On the board layout

from the power supply circuit, run the power and

return traces to the decoupling capacitors first,

and then to the device pins. This ensures that the

decoupling capacitors are first in the power chain.

Equally important is to keep the trace length

between the capacitor and the power pins to a

minimum thereby reducing PCB track inductance.

Note 1: This data sheet summarizes the features

of

the

dsPIC33FJ32GP302/304,

dsPIC33FJ64GPX02/X04,

and

dsPIC33FJ128GPX02/X04

family

of

devices. It is not intended to be a

comprehensive reference source. To

complement the information in this data

sheet, refer to the “dsPIC33F/PIC24H

Family Reference Manual”, which is

available from the Microchip website

(www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

Note:

The AVDD and AVSS pins must be

connected independent of the ADC

voltage reference source.

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