
TS5A3153
1 W SPDT ANALOG SWITCH
5V/3.3V SINGLECHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER
SCDS215 – OCTOBER 2005
www.ti.com
2
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar
WCSP (DSBGA)
0.17mm Small Bump YEA
TS5A3153YEAR
PREVIEW
NanoFree
WCSP (DSBGA)
0.17-mm Small Bump YZA (Pb-free)
Tape and reel
TS5A3153YZAR
PREVIEW
40
°C to 85°C
NanoStar
WCSP (DSBGA)
0.23-mm Large Bump YEP
Tape and reel
TS5A3153YEPR
PREVIEW
NanoFree
WCSP (DSBGA)
0.23-mm Large Bump YZP (Pb-free)
TS5A3153YZPR
PREVIEW
SSOP DCT
Tape
TS5A3153DCT
PREVIEW
VSSOP DCU
Tape and reel
TS5A3153DCUR
JCD
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character
to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
Absolute Minimum and Maximum Ratings(1)(2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V+
Supply voltage range(3)
0.5
6.5
V
VNC
VNO
VCOM
Analog voltage range(3)(4)(5)
0.5
V+ + 0.5
V
IK
Analog port diode current
VNC, VNO, VCOM < 0
50
mA
INC
INO
On-state switch current
VNC, VNO, VCOM = 0 to V+
200
mA
NC
INO
ICOM
On-state peak switch current(6)
VNC, VNO, VCOM = 0 to V+
400
mA
VI
Digital input voltage range(3)(4)
0.5
6.5
V
IIK
Digital input clamp current
VI < 0
50
mA
I+
Continuous current through V+
100
mA
IGND
Continuous current through GND
100
mA
(7)
DCT package
220
θJA
Package thermal impedance(7)
DCU package
227
°C/W
θJA
Package thermal impedance(7)
140
°C/W
YEP/YZP package
102
Tstg
Storage temperature range
65
150
°C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified
is not implied.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(3) All voltages are with respect to ground, unless otherwise specified.
(4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(5) This value is limited to 5.5 V maximum.
(6) Pulse at 1 ms duration < 10% duty cycle
(7) The package thermal impedance is calculated in accordance with JESD 51-7.