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參數(shù)資料
| 型號(hào)： | TRF4000 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | Pcs RX-mixer |
| 中文描述： | Pcs RX-混頻器 |
| 文件頁(yè)數(shù)： | 7/8頁(yè) |
| 文件大?。?/td> | 100K |
| 代理商： | TRF4000 |
TRF4000
PCS RF DOWNCONVERTER
SLWS050 – MAY 1999
7
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
PWP (R-PDSO-G**)
PowerPAD
PLASTIC SMALL-OUTLINE PACKAGE
4073225/E 03/97
0,50
0,75
0,25
0,15 NOM
Thermal Pad
(See Note C)
Gage Plane
28
24
7,70
7,90
20
6,40
6,60
9,60
9,80
6,60
6,20
11
0,19
4,50
4,30
10
0,15
20
A
1
0,30
1,20 MAX
16
14
5,10
4,90
PINS **
4,90
5,10
DIM
A MIN
A MAX
0,05
Seating Plane
0,65
0,10
M
0,10
0
°–8°
20-PIN SHOWN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This solderable pad
is electrically and thermally connected to the backside of the die and possibly selected leads. The maximum pad size on the printed
circult board should be equal to the package body size – 2,0mm.
PowerPAD is a trademark of Texas Instruments Incorporated.
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