參數(shù)資料
型號: TQ8318
英文描述: Telecommunication IC
中文描述: 通信集成電路
文件頁數(shù): 9/10頁
文件大小: 460K
代理商: TQ8318
TQ8318/TQ8319
PRELIMINARY DATA SHEET
9
S
P
T
P
Ordering Information
TQ8318
10.7 Gb/s Backterminated EO Driver +3.3/-7.5V TSSOP Package
TQ8319
10.7 Gb/s Unterminated EO Driver +3.3/-7.5V TSSOP Package
TQ8318-DD
DC Tested TQ8318 Die
TQ8318-DA
AC Tested TQ8318 Die
TQ8319-DD
DC Tested TQ8319 Die
TQ8319-DA
Related Components:
AC Tested TQ8319 Die
TQ8317
10.7 Gb/s Backterminated EO Driver +3.3/-5V TSSOP Package
TQ8320
10.7 Gb/s Unterminated EO Driver +3.3/-5V TSSOP Package
TGA1328
Single ended 9V driver - die form
TGA8652
Single ended 9V driver - packaged form
Additional Information
For latest specifications, additional product information, worldwide sales and distribution locations, and
information about TriQuint:
Web: www.triquint.com
Email: sales@tqs.com
Tel: (503) 615-9000 (Oregon, USA)
Fax: (503) 615-8900 (Oregon, USA)
For technical questions and additional information on specific applications:
Email: applications@tqs.com
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes
no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications
are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any
third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems.
Copyright 2001 TriQuint Semiconductor, Inc. All rights reserved.
Revision 0.0.A August 2001
Approximate Actual Size of Package Footprint
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