![](http://datasheet.mmic.net.cn/370000/TPS75315Q_datasheet_16739813/TPS75315Q_26.png)
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
Package
Drawing
PWP
PWP
PWP
PWP
PWP
PWP
PWP
PWP
PWP
PWP
PWP
PWP
PWP
PWP
PWP
Pins Package
Qty
70
2000
70
2000
70
2000
70
2000
70
2000
70
2000
70
2000
2000 Green (RoHS &
no Sb/Br)
70
2000
70
2000
70
2000
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TPS75101QPWP
TPS75101QPWPR
TPS75115QPWP
TPS75115QPWPR
TPS75118QPWP
TPS75118QPWPR
TPS75125QPWP
TPS75125QPWPR
TPS75133QPWP
TPS75133QPWPR
TPS75301QPWP
TPS75301QPWPR
TPS75315QPWP
TPS75315QPWPR
TPS75315QPWPRG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
None
None
None
None
None
None
None
None
None
None
None
None
None
None
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-2-260C-1 YEAR
TPS75318QPWP
TPS75318QPWPR
TPS75325QPWP
TPS75325QPWPR
TPS75333QPWP
TPS75333QPWPR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
HTSSOP
PWP
PWP
PWP
PWP
PWP
PWP
20
20
20
20
20
20
None
None
None
None
None
None
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Level-1-220C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
Addendum-Page 1