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參數(shù)資料
| 型號： | TPS736XX_08 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | Cap-Free, NMOS, 400mA Low-Dropout Regulator with Reverse Current Protection |
| 中文描述： | 無電容，NMOS管，400mA的低壓差穩(wěn)壓器的反向電流保護 |
| 文件頁數(shù)： | 13/26頁 |
| 文件大?。?/td> | 873K |
| 代理商： | TPS736XX_08 |
www.ti.com
(Fixed Voltage Version)
dV dt
V
OUT
80k
C
OUT
R
LOAD
(4)
Power Dissipation
The ability to remove heat from the die is different for
each
package
type,
considerations in the PCB layout. The PCB area
around the device that is free of other components
moves the heat from the device to the ambient air.
Performance data for JEDEC low- and high-K boards
are shown in the
Power Dissipation Ratings
table.
Using heavier copper will increase the effectiveness
in removing heat from the device. The addition of
plated through-holes to heat-dissipating layers will
also improve the heat-sink effectiveness.
(Adjustable Voltage Version)
dV dt
V
OUT
(R
1
C
OUT
80k
R
2
) R
LOAD
(5)
Reverse Current
The NMOS pass element of the TPS736xx provides
inherent protection against current flow from the
output of the regulator to the input when the gate of
the pass device is pulled low. To ensure that all
charge is removed from the gate of the pass element,
the enable pin must be driven low before the input
voltage is removed. If this is not done, the pass
element may be left on due to stored charge on the
gate.
P
D
(V
IN
V
OUT
)
I
OUT
(6)
Thermal Protection
Thermal protection disables the output when the
junction temperature rises to approximately +160
°
C,
allowing the device to cool. When the junction
temperature cools to approximately +140
°
C, the
output circuitry is again enabled. Depending on power
dissipation,
thermal
resistance,
temperature, the thermal protection circuit may cycle
on and off. This limits the dissipation of the regulator,
protecting it from damage due to overheating.
Package Mounting
Solder
pad
TPS736xx
Solder Pad Recommendations for Surface-Mount
Devices
(
SBFA015
),
available
Instruments web site at
www.ti.com
.
TPS736xx
SBVS038Q–SEPTEMBER 2003–REVISED AUGUST 2007
The TPS736xx does not have active pull-down when
the output is over-voltage. This allows applications
that
connect
higher
voltage
alternate power supplies, to the output. This also
results in an output overshoot of several percent if
load current quickly drops to zero when a capacitor is
connected to the output. The duration of overshoot
can be reduced by adding a load resistor. The
overshoot decays at a rate determined by output
capacitor
C
OUT
and
the
resistance. The rate of decay is given by:
Any tendency to activate the thermal protection circuit
indicates
excessive
power
inadequate heat sink. For reliable operation, junction
temperature should be limited to +125
°
C maximum.
To estimate the margin of safety in a complete design
(including
heat
sink),
temperature until the thermal protection is triggered;
use worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
+35
°
C
above
the
maximum
condition
of
your
application.
worst-case junction temperature of +125
°
C at the
highest
expected
ambient
worst-case load.
dissipation
or
an
sources,
such
as
increase
the
ambient
internal/external
load
expected
This
ambient
produces
a
temperature
and
The internal protection circuitry of the TPS736xx has
been designed to protect against overload conditions.
It was not intended to replace proper heat sinking.
Continuously running the TPS736xx into thermal
shutdown degrades device reliability.
presenting
different
Power dissipation depends on input voltage and load
conditions. Power dissipation (P
D
) is equal to the
product of the output current times the voltage drop
across the output pass element (V
IN
to V
OUT
):
After the enable pin is driven low, no bias voltage is
needed on any pin for reverse current blocking. Note
that reverse current is specified as the current flowing
out of the IN pin due to voltage applied on the OUT
pin. There will be additional current flowing into the
OUT pin due to the 80k
internal resistor divider to
ground (see
Figure 1
and
Figure 2
).
Power dissipation can be minimized by using the
lowest possible input voltage necessary to assure the
required output voltage.
For the TPS73601, reverse current may flow when
V
FB
is more than 1.0V above V
IN
.
footprint
are
presented
recommendations
in
Application
for
Bulletin
the
from
the
Texas
and
ambient
Copyright 2003–2007, Texas Instruments Incorporated
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Product Folder Link(s):
TPS736xx
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