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參數(shù)資料
| 型號： | TPS71025PW |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | LOW-DROPOUT VOLTAGE REGULATOR |
| 中文描述： | 低壓差穩(wěn)壓器 |
| 文件頁數(shù)： | 11/20頁 |
| 文件大?。?/td> | 308K |
| 代理商： | TPS71025PW |
TPS71025
LOW-DROPOUT VOLTAGE REGULATOR
SLVS162A – MAY 1997 – REVISED MAY 1998
11
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL INFORMATION
In response to system-miniaturization trends, integrated circuits are being offered in low-profile and fine-pitch
surface-mount packages. Implementation of many of today’s high-performance devices in these packages
requires special attention to power dissipation. Many system-dependent issues such as thermal coupling,
airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components
affect the power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are illustrated in this discussion:
Improving the power-dissipation capability of the PWB design
Improving the thermal coupling of the component to the PWB
Introducing airflow in the system
Figure 16 is an example of a thermally enhanced PWB layout for the 20-lead TSSOP package. This layout
involves adding copper on the PWB to conduct heat away from the device. The R
θ
JA
for this component/board
system is illustrated in Figure 17. The family of curves illustrates the effect of increasing the size of the
copper-heat-sink surface area. The PWB is a standard FR4 board (L
×
W
×
H = 3.2 inch
×
3.2 inch
×
0.062 inch);
the board traces and heat sink area are 1-oz (per square foot) copper.
Copper Heat Sink
1 oz Copper
Figure 16. Thermally Enhanced PWB Layout (Not to Scale) for the 20-Pin TSSOP
Figure 18 shows the thermal resistance for the same system with the addition of a thermally conductive
compound between the body of the TSSOP package and the PWB copper routed directly beneath the device.
The thermal conductivity for the compound used in this analysis is 0.815 W/m
×
°
C.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TPS71025PWR | 功能描述:低壓差穩(wěn)壓器 - LDO LDO Reg RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS71025PWRG4 | 功能描述:低壓差穩(wěn)壓器 - LDO LDO Reg RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS71025Y | 制造商:TI 制造商全稱:Texas Instruments 功能描述:LOW-DROPOUT VOLTAGE REGULATOR |
| TPS71202 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:SYNCHRONOUS SEPIC / FLYBACK CONVERTER WITH 1.1A SWITCH AND INTEGRATED LDO |
| TPS71202DRCR | 功能描述:低壓差穩(wěn)壓器 - LDO Dual 250 mA Output UltraLow Noise RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
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