參數(shù)資料
型號(hào)： TPS65270RGET
廠商： TEXAS INSTRUMENTS INC
元件分類： 穩(wěn)壓器
英文描述： DUAL SWITCHING CONTROLLER, 1400 kHz SWITCHING FREQ-MAX, PQCC24
封裝： 4 X 4 MM, PLASTIC, VQFN-24
文件頁(yè)數(shù)： 8/20頁(yè)
文件大?。?/td> 1432K
代理商： TPS65270RGET
SLVSAX7
– AUGUST 2011
Low Power Mode Operation
By pulling the Low_P pin high all converters will operate in pulse-skipping mode, greatly reducing the overall
power consumption at light and no load conditions. When LOW_P is tied to low, all converters run in forced PWM
mode.
Thermal Shutdown
The device implements an internal thermal shutdown to protect itself if the junction temperature exceeds 160
°C.
The thermal shutdown forces the device to stop switching when the junction temperature exceeds thermal trip
threshold. Once the die temperature decreases below 140
°C, the device reinitiates the power up sequence. The
thermal shutdown hysteresis is 20
°C.
Layout Recommendations
Layout is a critical portion of PMIC designs.
Place VOUT, and LX on the top layer and an inner power plane for VIN.
Fit also on the top layer connections for the remaining pins of the PMIC and a large top side area filled with
ground.
The top layer ground area sould be connected to the bottom ground layer(s) using vias at the input bypass
capacitor, the output filter cpacitor and directly under the TPS65270 device to provide a thermal path from the
Powerpad land to ground.
The AGND pin should be tied directly to the power pad under the IC and the power pad.
For operation at full rated load, the top side ground area together with the bottom ground plane, must provide
adequate heat dissipating area.
There are several signals paths that conduct fast changing currents or voltages that can interact with stray
inductance or parasitic capacitance to generate noise or degrade the power supplies performance. To help
eliminate these problems, the VIN pin should be bypassed to ground with a low ESR ceramic bypass
capacitor with X5R or X7R dielectric. Care should be taken to minimize the loop area formed by the bypass
capacitor connections, the VIN pins, and the ground connections. Since the LX connection is the switching
node, the output inductor should be located close to the LX pins, and the area of the PCB conductor
minimized to prevent excessive capacitive coupling.
The output filter capacitor ground should use the same power ground trace as the VIN input bypass capacitor.
Try to minimize this conductor length while maintaining adequate width.
The compensation should be as close as possible to the COMP pins. The COMP and OSC pins are sensitive
to noise so the components associated to these pins should be located as close as possible to the IC and
routed with minimal lengths of trace.
16
Copyright
2011, Texas Instruments Incorporated
Product Folder Link(s): TPS65270
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