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參數(shù)資料
| 型號： | TPS55383PWPRG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 7 A DUAL SWITCHING CONTROLLER, 300 kHz SWITCHING FREQ-MAX, PDSO16 |
| 封裝： | PLASTIC, HTSSOP-26 |
| 文件頁數(shù)： | 21/45頁 |
| 文件大小： | 1318K |
| 代理商： | TPS55383PWPRG4 |
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0
0.4
0.6
0.8
1.0
1.8
0.2
0
20
40
60
140
80
100
120
T
A
- Ambient Temperature - °C
P
D
-
P
o
w
e
r
D
is
s
ip
a
ti
o
n
-
W
0
150
250
500
LFM
1.2
1.6
1.4
LFM = 0
LFM = 150
LFM = 250
LFM = 500
PowerPAD Package
SLUS818 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
POWER DISSIPATION
vs
AMBIENT TEMPERATURE
Figure 30. Power Derating Curves
The PowerPAD package provides low thermal impedance for heat removal from the device. The PowerPAD
derives its name and low thermal impedance from the large bonding pad on the bottom of the device. The circuit
board must have an area of solder-tinned-copper underneath the package. The dimensions of this area depend
on the size of the PowerPAD package. Thermal vias connect this area to internal or external copper planes and
should have a drill diameter sufficiently small so that the via hole is effectively plugged when the barrel of the via
is plated with copper. This plug is needed to prevent wicking the solder away from the interface between the
package body and the solder-tinned area under the device during solder reflow. Drill diameters of 0.33 mm (13
mils) work well when 1-oz. copper is plated at the surface of the board while simultaneously plating the barrel of
the via. If the thermal vias are not plugged when the copper plating is performed, then a solder mask material
should be used to cap the vias with a diameter equal to the via diameter of 0.1 mm minimum. This capping
prevents the solder from being wicked through the thermal vias and potentially creating a solder void under the
package. (See the Additional References section.)
28
Copyright 2008, Texas Instruments Incorporated
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| TPS55386EVM-363 | 功能描述:電源管理IC開發(fā)工具 TPS55386EVM-363 Eval Mod RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V |
| TPS55386PWP | 功能描述:直流/直流開關(guān)調(diào)節(jié)器 3A Dual Non-Synch Buck Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5 |
| TPS55386PWPG4 | 功能描述:直流/直流開關(guān)調(diào)節(jié)器 3A,Dual Non-Synch Buck Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5 |
| TPS55386PWPR | 功能描述:直流/直流開關(guān)調(diào)節(jié)器 3A Dual Non-Synch Buck Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5 |
| TPS55386PWPRG4 | 功能描述:直流/直流開關(guān)調(diào)節(jié)器 3A,Dual Non-Synch Buck Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5 |
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