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參數(shù)資料
| 型號： | TPS54974PWP |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 16 A SWITCHING REGULATOR, 762 kHz SWITCHING FREQ-MAX, PDSO28 |
| 封裝： | GREEN, PLASTIC, HTSSOP-28 |
| 文件頁數(shù)： | 12/21頁 |
| 文件大?。?/td> | 743K |
| 代理商： | TPS54974PWP |
www.ti.com
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
DISSIPATION RATINGS
(1) (2)
TPS54974
SLVS458B – JANUARY 2003 – REVISED FEBRUARY 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
TA
OUTPUT VOLTAGE
PACKAGE
PART NUMBER
–40
°C to 85°C
Adjustable down to 0.9 V
Plastic HTSSOP (PWP)(1)
TPS54974PWP
(1)
The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54974PWPR). See the application
section of the data sheet for PowerPAD drawing and layout information.
over operating free-air temperature range unless otherwise noted(1)
TPS54974
SS/ENA
–0.3 V to 7 V
RT
–0.3 V to 6 V
VI
Input voltage range
VSENSE
–0.3 V to 4 V
PVIN, VIN
–0.3 V to 4.5 V
BOOT
–0.3 V to 10 V
VBIAS, COMP, PWRGD
–0.3 V to 7 V
VO
Output voltage range
PH
–0.6 V to 6 V
PH
Internally limited
IO
Source current
COMP, VBIAS
6 mA
PH
16 A
IS
Sink current
COMP
6 mA
SS/ENA, PWRGD
10 mA
Voltage differential
AGND to PGND
±0.3 V
TJ
Operating virtual junction temperature range
–40
°C to 125°C
Tstg
Storage temperature
–65
°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
300
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
MIN NOM
MAX
UNIT
VI
Input voltage, VIN
3
4
V
PVIN
Power input voltage
2.2
2.5
4.0
V
TJ
Operating junction temperature
–40
125
°C
THERMAL IMPEDANCE
TA = 25°C
TA = 70°C
TA = 85°C
PACKAGE
JUNCTION-TO-AMBIENT
POWER RATING
28-Pin PWP with solder
14.4
°C/W
6.94 W(3)
3.81 W
2.77 W
28-Pin PWP without solder
27.9
°C/W
3.58 W
1.97 W
1.43 W
(1)
For more information on the PWP package, see TI technical brief, literature number SLMA002.
(2)
Test board conditions:
a. 3-inch x 3-inch, 4 layers, thickness: 0.062-inch
b. 1.5-oz. copper traces located on the top of the PCB
c. 1.5-oz. copper ground plane on the bottom of the PCB
d. 0.5-oz. copper ground planes on the 2 internal layers
e. 12 thermal vias (see "Recommended Land Pattern" in applications section of this data sheet)
(3)
Maximum power dissipation may be limited by overcurrent protection.
2
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