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參數(shù)資料
| 型號： | TPS51206DSQT |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | SWITCHING REGULATOR, PDSO10 |
| 封裝： | 2 X 2 MM, GREEN, PLASTIC, SON-10 |
| 文件頁數(shù)： | 6/23頁 |
| 文件大?。?/td> | 603K |
| 代理商： | TPS51206DSQT |
UDG-11135
0.22 mF
0402
0.1 mF
0402
VLDOIN
VTT
PGND
VTTSNS
VDD
S5
GND
S3
VTTREF
VDDQSNS
Via to Ground Plane
Via for VTTSNS
VTTREF Output
5-V or 3.3-V Supply Input
VTT Output
V
D
Q
S
e
n
se
In
p
u
t
V
T
P
o
w
e
r
S
u
pp
ly
In
p
u
t
Etch Beneath Component
10 mF
0603
10 mF
0603
SLUSAH1
– MAY 2011
LAYOUT CONSIDERATIONS
Figure 25. PCB Layout Guideline
Consider the following before beginning a TPS51206 layout design.
The input bypass capacitor for VLDOIN should be placed as close as possible to the terminal with short and
wide connections.
The output capacitor for VTT should be placed close to the terminals (VTT and PGND) with short and wide
connection in order to avoid additional ESR and/or ESL trace inductance.
VTTSNS should be connected to the positive node of VTT output capacitor(s) as a separate trace from the
high current VTT power trace. In addition, VTTSNS trace should be routed away from high current trace, on
the separate layer is recommended. This configuration is strongly recommended to avoid additional ESR
and/or ESL. If sensing the voltage at the point of the load is required, it is recommended to attach the output
capacitor(s) at that point. In addition, it is recommended to minimize any additional ESR and/or ESL of ground
trace between the GND pin and the VTT capacitor(s).
The GND pin (and the negative node of the VTTREF output capacitor) and PGND pins (and the negative
node of the VTT output capacitor) should be connected to the internal system ground planes (for better result,
use at least two internal ground planes) with multiple vias. Use as many vias as possible to reduce the
impedance between GND/PGND and the system ground plane.
In order to effectively remove heat from the package, properly prepare the thermal land. Apply solder directly
to the package thermal pad. The wide traces of the component and the side copper connected to the thermal
land pad help to dissipate heat. Numerous vias 0.33 mm in diameter connected from the thermal land to the
internal/solder side ground plane(s) should also be used to help dissipation. Please consult the
TPS51206-EVM User's Guide for more detailed layout recommendations.
14
Copyright
2011, Texas Instruments Incorporated
Product Folder Link(s): TPS51206
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