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參數(shù)資料
| 型號(hào)： | TPS2554DRCT |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 電源管理 |
| 英文描述： | POWER SUPPLY SUPPORT CKT, PDSO10 |
| 封裝： | PLASTIC, SON-10 |
| 文件頁數(shù)： | 17/23頁 |
| 文件大?。?/td> | 1035K |
| 代理商： | TPS2554DRCT |
SLVSAM0
– JUNE 2011
THERMAL INFORMATION
TPS2554/TPS2555
THERMAL METRIC(1)
DRC
UNITS
14 PINS
θJA
Junction-to-ambient thermal resistance(2)
45.9
θJCtop
Junction-to-case (top) thermal resistance(3)
53.4
θJB
Junction-to-board thermal resistance(4)
21.4
°C/W
ψJT
Junction-to-top characterization parameter(5)
1.0
ψJB
Junction-to-board characterization parameter(6)
21.6
θJCbot
Junction-to-case (bottom) thermal resistance(7)
5.9
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3)
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4)
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7)
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Copyright
2011, Texas Instruments Incorporated
3
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