參數(shù)資料
型號(hào)： TPS2001CDGNR
廠(chǎng)商： TEXAS INSTRUMENTS INC
元件分類(lèi)： 模擬信號(hào)調(diào)理
英文描述： SPECIALTY ANALOG CIRCUIT, PDSO8
封裝： PLASTIC, MSOP-8
文件頁(yè)數(shù)： 8/28頁(yè)
文件大小： 1476K
代理商： TPS2001CDGNR
C
IN
V
IN: 0.0145in
2 area
& 2 x 0.018in vias
GND: 0.056in
2 total area
& 3 x 0.018in vias
C
OUT
V
OUT:
0.048in
2 total area
5 x 0.01in vias
0.050in trace
C
OUT
VIN: 0.00925in
2
& 3 x 0.018in vias
VOUT: 0.041in
2 total
0.050in trace
4 x 0.01in vias
C
IN
GND: 0.052in
2 Total
& 3 x 0.018in vias
SLVSAU6B
– JUNE 2011 – REVISED SEPTEMBER 2011
Figure 41. DBV Package PCB Layout Example
Figure 42. DGN Package PCB Layout Example
The following procedure requires iteration because power loss is due to the internal MOSFET I2
× RDS(ON), and
RDS(ON) is a function of the junction temperature. As an initial estimate, use the RDS(ON) at 125°C from the
TYPICAL CHARACTERISTICS, and the preferred package thermal resistance for the preferred board
construction from the THERMAL INFORMATION table.
TJ = TA + ((IOUT2 x RDS(ON)) x θJA)
(1)
Where:
IOUT = rated OUT pin current (A)
RDS(ON) = Power switch on-resistance at an assumed TJ (Ω)
TA = Maximum ambient temperature (°C)
TJ = Maximum junction temperature (°C)
θJA = Thermal resistance (°C/W)
If the calculated TJ is substantially different from the original assumption, estimate a new value of RDS(ON) using
the typical characteristic plot and recalculate.
If the resulting TJ is not less than 125°C, try a PCB construction and/or package with lower θJA .
SPACER
REVISION HISTORY
Changes from Original (June 2011) to Revision A
Page
Updated MSOP Devices Status From: Preview To: Active .................................................................................................. 1
Corrected pinout numbers for the 5-PIN PACKAGE ............................................................................................................ 6
Changes from Revision A (July 2011) to Revision B
Page
Added the DGK Package Information throughout the data sheet ........................................................................................ 1
Changed title of Figure 15 From: NEW FIG To: TPS2065C 50
Ω Short Circuit ................................................................... 8
16
Copyright
2011, Texas Instruments Incorporated
Product Folder Link(s) :TPS20xxC
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPS2001DDBVT 功能描述:TPS2001DDBVT 制造商:texas instruments 系列:* 包裝:剪切帶（CT） 零件狀態(tài):在售 封裝/外殼:SC-74A，SOT-753 供應(yīng)商器件封裝:SOT-23-5 標(biāo)準(zhǔn)包裝:1
TPS2001DDGK 功能描述:SINGLE CHANNEL, CURRENT-LIMITED 制造商:texas instruments 系列:- 包裝:管件 零件狀態(tài):在售 開(kāi)關(guān)類(lèi)型:USB 開(kāi)關(guān) 輸出數(shù):1 比率 - 輸入:輸出:1:1 輸出配置:高端 輸出類(lèi)型:N 通道 接口:開(kāi)/關(guān) 電壓 - 負(fù)載:4.5 V ~ 5.5 V 電壓 - 電源（Vcc/Vdd）:不需要 電流 - 輸出（最大值）:2A 導(dǎo)通電阻（典型值）:72 毫歐 輸入類(lèi)型:非反相 特性:狀態(tài)標(biāo)志 故障保護(hù):限流（固定），超溫，反向電流，UVLO 工作溫度:-40°C ~ 125°C （TJ） 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商器件封裝:8-VSSOP 標(biāo)準(zhǔn)包裝:80
TPS2002C 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:Dual Channel, Current-Limited, Power-Distribution Switches
TPS2002CDRCR 功能描述:電源開(kāi)關(guān) IC - USB Dual-CH Current-LTD Pwr-Dist Switch RoHS:否 制造商:Micrel 電源電壓-最小:2.7 V 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-8 封裝:Tube
TPS2002CDRCT 功能描述:電源開(kāi)關(guān) IC - USB Dual-CH Current-LTD Pwr-Dist Switch RoHS:否 制造商:Micrel 電源電壓-最小:2.7 V 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-8 封裝:Tube
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