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參數(shù)資料
| 型號： | TPS2000CDGN |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 模擬信號調(diào)理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO8 |
| 封裝： | PLASTIC, MSOP-8 |
| 文件頁數(shù)： | 8/28頁 |
| 文件大?。?/td> | 1476K |
| 代理商： | TPS2000CDGN |
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C
IN
V
IN: 0.0145in
2 area
& 2 x 0.018in vias
GND: 0.056in
2 total area
& 3 x 0.018in vias
C
OUT
V
OUT:
0.048in
2 total area
5 x 0.01in vias
0.050in trace
C
OUT
VIN: 0.00925in
2
& 3 x 0.018in vias
VOUT: 0.041in
2 total
0.050in trace
4 x 0.01in vias
C
IN
GND: 0.052in
2 Total
& 3 x 0.018in vias
SLVSAU6B
– JUNE 2011 – REVISED SEPTEMBER 2011
Figure 41. DBV Package PCB Layout Example
Figure 42. DGN Package PCB Layout Example
The following procedure requires iteration because power loss is due to the internal MOSFET I2
× RDS(ON), and
RDS(ON) is a function of the junction temperature. As an initial estimate, use the RDS(ON) at 125°C from the
TYPICAL CHARACTERISTICS, and the preferred package thermal resistance for the preferred board
construction from the THERMAL INFORMATION table.
TJ = TA + ((IOUT2 x RDS(ON)) x θJA)
(1)
Where:
IOUT = rated OUT pin current (A)
RDS(ON) = Power switch on-resistance at an assumed TJ (Ω)
TA = Maximum ambient temperature (°C)
TJ = Maximum junction temperature (°C)
θJA = Thermal resistance (°C/W)
If the calculated TJ is substantially different from the original assumption, estimate a new value of RDS(ON) using
the typical characteristic plot and recalculate.
If the resulting TJ is not less than 125°C, try a PCB construction and/or package with lower θJA .
SPACER
REVISION HISTORY
Changes from Original (June 2011) to Revision A
Page
Updated MSOP Devices Status From: Preview To: Active .................................................................................................. 1
Corrected pinout numbers for the 5-PIN PACKAGE ............................................................................................................ 6
Changes from Revision A (July 2011) to Revision B
Page
Added the DGK Package Information throughout the data sheet ........................................................................................ 1
Changed title of Figure 15 From: NEW FIG To: TPS2065C 50
Ω Short Circuit ................................................................... 8
16
Copyright
2011, Texas Instruments Incorporated
Product Folder Link(s) :TPS20xxC
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPS2000CDGNR | 功能描述:電源開關(guān) IC - USB SGL CH,CURRENT-LTD USB PWR DISTR SWITCH RoHS:否 制造商:Micrel 電源電壓-最小:2.7 V 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| TPS2001C-2 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Current-Limited, Power-Distribution Switches |
| TPS2001CDGK | 功能描述:電源開關(guān) IC - USB Sgl Channel,Crnt-Ltd USB Pwr Dist Switch RoHS:否 制造商:Micrel 電源電壓-最小:2.7 V 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| TPS2001CDGKR | 功能描述:電源開關(guān) IC - USB Sgl Channel,Crnt-Ltd USB Pwr Dist Switch RoHS:否 制造商:Micrel 電源電壓-最小:2.7 V 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| TPS2001CDGN | 功能描述:電源開關(guān) IC - USB SGL CH,CURRENT-LTD USB PWR DISTR SWITCH RoHS:否 制造商:Micrel 電源電壓-最小:2.7 V 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-8 封裝:Tube |
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