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參數(shù)資料
| 型號： | TPL9202PWPG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 電源管理 |
| 英文描述： | 8-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO20 |
| 封裝： | GREEN, PLASTIC, HTSSOP-20 |
| 文件頁數(shù)： | 3/18頁 |
| 文件大?。?/td> | 432K |
| 代理商： | TPL9202PWPG4 |
www.ti.com
PCB Layout
Application Using a Multilayer PCB
PackageThermalPad
SolderPad(LandPattern)
ThermalVias
PackageOutline
PowerPad
PackageSolderPad
(BottomTrace)
ThermalVia
ComponentTraces
ThermalIsolation
PowerPlaneOnly
1.5748mm
0.0 0.071-mmBoardBase
–
andBottomPad
0.5246 0.5606-mm
–
PowerPlane
(1-ozCu)
1.0142 1.0502-mm
–
GroundPlane
(1-ozCu)
1.5038 1.5748-mm
–
ComponentTrace
(2-ozCu)
2Plane
4Plane
Application Using a Single-Layer PCB
8-CHANNEL RELAY DRIVER
WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION
SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008
To maximize the efficiency of this package for application on a single layer or multilayer PCB, certain guidelines
must be followed when laying out this part on the PCB.
The following information is to be used as a guideline only.
For further information, see the PowerPAD concept implementation document.
In a multilayer board application, the thermal vias are the primary method of heat transfer from the package
thermal pad to the internal ground plane (see Figure 4 and Figure 5).
The efficiency of this method depends on several factors: die area, number of thermal vias, thickness of copper,
etc. (see the PowerPAD Thermally Enhanced Package Technical Brief, literature number SLMA002).
Figure 4. Package and PCB Land Configuration for a Multilayer PCB
Figure 5. Multilayer Board (Side View)
In a single-layer board application, the thermal pad is attached to a heat spreader (copper areas) by a low
thermal-impedance attachment method (solder paste or thermal conductive epoxy). With either method, it is
advisable to use as many copper traces as possible to dissipate the heat.
Copyright 2006–2008, Texas Instruments Incorporated
11
Product Folder Link(s): TPL9202
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TPL9202PWPR | 功能描述:外圍驅動器與原件 - PCI 8-Ch Relay Dr with Integrated 5V LDO RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| TPL9202PWPRG4 | 功能描述:外圍驅動器與原件 - PCI 8Ch Relay Drvr RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| TPL-BA | 功能描述:保險絲 TELPOWER FUSE RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風格: 端接類型:SMD/SMT 系列:485 |
| TPL-BASI1 | 制造商:Cooper Bussmann 功能描述:TELPOWER FUSE KIT - Bulk |
| TPL-BB | 功能描述:保險絲 TELPOWER FUSE RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風格: 端接類型:SMD/SMT 系列:485 |
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