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參數(shù)資料
| 型號(hào)： | TPIC9201N |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 電源管理 |
| 英文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDIP20 |
| 封裝： | ROHS COMPLIANT, PLASTIC, DIP-20 |
| 文件頁數(shù)： | 3/18頁 |
| 文件大?。?/td> | 434K |
| 代理商： | TPIC9201N |
www.ti.com
PCB Layout
Application Using a Multilayer PCB
PackageThermalPad
SolderPad(LandPattern)
ThermalVias
PackageOutline
PowerPad
PackageSolderPad
(BottomTrace)
ThermalVia
ComponentTraces
ThermalIsolation
PowerPlaneOnly
1.5748mm
0.0 0.071-mmBoardBase
–
andBottomPad
0.5246 0.5606-mm
–
PowerPlane
(1-ozCu)
1.0142 1.0502-mm
–
GroundPlane
(1-ozCu)
1.5038 1.5748-mm
–
ComponentTrace
(2-ozCu)
2Plane
4Plane
Application Using a Single-Layer PCB
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS115D – APRIL 2005 – REVISED FEBRUARY 2008
To maximize the efficiency of this package for application on a single-layer or multilayer PCB, certain guidelines
must be followed when laying out this part on the PCB.
The following information is to be used as a guideline only.
For further information, see the PowerPAD concept implementation document.
In a multilayer board application, the thermal vias are the primary method of heat transfer from the package
thermal pad to the internal ground plane (see Figure 4 and Figure 5).
The efficiency of this method depends on several factors: die area, number of thermal vias, thickness of copper,
etc. (see the PowerPAD Thermally Enhanced Package Technical Brief, literature number SLMA002).
Figure 4. Package and PCB Land Configuration for a Multilayer PCB
Figure 5. Multilayer Board (Side View)
In a single-layer board application, the thermal pad is attached to a heat spreader (copper area) by using the low
thermal-impedance attachment method (solder paste or thermal-conductive epoxy). With either method, it is
advisable to use as much copper trace area as possible to dissipate the heat.
Copyright 2005–2008, Texas Instruments Incorporated
11
Product Folder Link(s): TPIC9201
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPIC9201NE4 | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI Micro Power Supply and Low-Side Driver RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| TPIC9201PWP | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI Micro Power Supply and Low-Side Driver RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| TPIC9201PWPG4 | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI Micro Power Supply and Low-Side Driver RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| TPIC9201PWPR | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI Micro Power Supply and Low-Side Driver RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| TPIC9201PWPRG4 | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI Micro Power Supply and Low-Side Driver RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
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