參數(shù)資料
型號: TPIC0108BDWP
廠商: Texas Instruments, Inc.
英文描述: CONNECTOR ACCESSORY
中文描述: 連接器附件
文件頁數(shù): 13/14頁
文件大?。?/td> 205K
代理商: TPIC0108BDWP
TPIC0108B
PWMCONTROL INTELLIGENT H-BRIDGE
SLIS068 – NOVEMBER1998
13
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
DWP (R-PDSO-G**)
PowerPAD
PLASTIC SMALL-OUTLINE PACKAGE
Gage Plane
0.419 (10,65)
0.400 (10,16)
0.010 (0,25) NOM
Thermal Pad
(See Note D)
0.010 (0,25)
0.016 (0,40)
0.050 (1,27)
Seating Plane
4147575/A 02/98
11
10
A
20-PIN SHOWN
20
1
0.104 (2,65) MAX
0.293 (7,45)
0.299 (7,59)
0.020 (0,51)
0.014 (0,35)
0.004 (0,10)
M
0.010 (0,25)
0.050 (1,27)
0
°
–8
°
0.710
(18,03)
28
0.510
(12,95)
20
0.610
(15,49)
24
0.700
(17,78)
0.500
(12,70)
(15,24)
0.600
0.410
(10,41)
16
DIM
PINS **
(10,16)
0.400
A MIN
A MAX
0.006 (0,15)
0.002 (0,05)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
PowerPAD is a trademark of Texas Instruments Incorporated.
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