參數(shù)資料
型號(hào)： TPA3123D2PWPR
廠商： Texas Instruments
文件頁(yè)數(shù)： 9/30頁(yè)
文件大?。?/td> 0K
描述： IC AMP AUDIO PWR 25W D 24TSSOP
標(biāo)準(zhǔn)包裝： 1
類(lèi)型： D 類(lèi)
輸出類(lèi)型： 2 通道（立體聲）
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量： 25W x 2 @ 4 歐姆
電源電壓： 10 V ~ 30 V
特點(diǎn)： 消除爆音，靜音，短路保護(hù)和熱保護(hù)，關(guān)機(jī)
安裝類(lèi)型： 表面貼裝
供應(yīng)商設(shè)備封裝： 24-HTSSOP
封裝/外殼： 24-TSSOP（0.173"，4.40mm）裸露焊盤(pán)
包裝： 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面： 877 (CN2011-ZH PDF)
配用： TPA3123D2EVM-ND - TPA3123D2EVM
其它名稱(chēng)： 296-22008-6
www.ti.com
SLOS541C – JULY 2007 – REVISED AUGUST 2010
THERMAL PROTECTION
Thermal protection on the TPA3123D2 prevents damage to the device when the internal die temperature
exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal set point, the device enters into the shutdown state and the outputs are disabled. This is not
a latched fault. The thermal fault is cleared once the temperature of the die is reduced by 30°C. The device
begins normal operation at this point with no external system interaction.
PRINTED-CIRCUIT BOARD (PCB) LAYOUT
Because the TPA3123D2 is a class-D amplifier that switches at a high frequency, the layout of the printed-circuit
board (PCB) should be optimized according to the following guidelines for the best possible performance.
Decoupling capacitors—The high-frequency 0.1-mF decoupling capacitors should be placed as close to the
PVCC (pins 1, 3, 10, and 12) and AVCC (pins 19 and 20) terminals as possible. The VBYP (pin 7) capacitor
and VCLAMP (pin 11) capacitor should also be placed as close to the device as possible. Large (220-mF or
greater) bulk power-supply decoupling capacitors should be placed near the TPA3123D2 on the PVCCL and
PVCCR terminals.
Grounding—The AVCC (pins 19 and 20) decoupling capacitor and VBYP (pin 7) capacitor should each be
grounded to analog ground (AGND, pins 8 and 9). The PVCCx decoupling capacitors and VCLAMP
capacitors should each be grounded to power ground (PGND, pins 13, 14, 23, and 24). Analog ground and
power ground should be connected at the thermal pad, which should be used as a central ground connection
or star ground for the TPA3123D2.
Output filter—The reconstruction filter (L1, L2, C9, and C16) should be placed as close to the output terminals
as possible for the best EMI performance. The capacitors should be grounded to power ground.
Thermal pad—The thermal pad must be soldered to the PCB for proper thermal performance and optimal
reliability. The dimensions of the thermal pad and thermal land are described in the mechanical section at the
back of the data sheet. See TI Technical Briefs SLMA002 and SLOA120 for more information about using the
thermal pad. For recommended PCB footprints, see figures at the end of this data sheet.
For an example layout, see the TPA3123D2 Evaluation Module (TPA3123D2EVM) User Manual, (SLOU189).
Both the EVM user manual and the thermal pad application note are available on the TI Web site at
Copyright 2007–2010, Texas Instruments Incorporated
17
Product Folder Link(s) :TPA3123D2
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPA3123D2PWPRG4 功能描述:音頻放大器 25W Stereo Class D Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA3124D2 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:15-W STEREO CLASS-D AUDIO POWER AMPLIFIER
TPA3124D2_1 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:15-W STEREO CLASS-D AUDIO POWER AMPLIFIER
TPA3124D2EVM 功能描述:音頻 IC 開(kāi)發(fā)工具 TPA3124D2EVM Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類(lèi)型:Audio Amplifiers 工具用于評(píng)估:TAS5614L 工作電源電壓:12 V to 38 V
TPA3124D2PWP 功能描述:音頻放大器 15W Stereo Class-D Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
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