參數(shù)資料
型號(hào)： TPA3005D2PHPG4
廠商： Texas Instruments
文件頁(yè)數(shù)： 10/31頁(yè)
文件大小： 0K
描述： IC AMP AUDIO PWR 6W STER 48TQFP
標(biāo)準(zhǔn)包裝： 250
類型： D 類
輸出類型： 2 通道（立體聲）
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量： 6W x 2 @ 8 歐姆
電源電壓： 8.5 V ~ 18 V
特點(diǎn)： 差分輸入，短路保護(hù)和熱保護(hù)，關(guān)機(jī)
安裝類型： 表面貼裝
供應(yīng)商設(shè)備封裝： 48-HTQFP（7x7）
封裝/外殼： 48-TQFP 裸露焊盤
包裝： 托盤
配用： 296-18924-ND - EVAL MODULE FOR TPA3005D2
SLOS427A – MAY 2004 – REVISED AUGUST 2010
www.ti.com
Decoupling capacitors—The high-frequency 0.1-F decoupling capacitors should be placed as close to the
PVCC (pins 14, 15, 22, 23, 38, 39, 46, and 47) and AVCC (pin 33) terminals as possible. The V2P5 (pin 4)
capacitor, AVDD (pin 29) capacitor, and VCLAMP (pins 25, 36) capacitor should also be placed as close to the
device as possible. Large (10 F or greater) bulk power supply decoupling capacitors should be placed near
the TPA3005D2 on the PVCCL, PVCCR, and AVCC terminals.
Grounding—The AVCC (pin 33) decoupling capacitor, AVDD (pin 29) capacitor, V2P5 (pin 4) capacitor, COSC
(pin 28) capacitor, and ROSC (pin 27) resistor should each be grounded to analog ground (AGND, pin 26 and
pin 30). The PVCC decoupling capacitors should each be grounded to power ground (PGND, pins 18, 19, 42,
and 43). Analog ground and power ground may be connected at the PowerPAD, which should be used as a
central ground connection or star ground for the TPA3005D2. Basically, an island should be created with a
single connection to PGND at the PowerPAD.
Output filter—The ferrite EMI filter (Figure 19) should be placed as close to the output terminals as possible
for the best EMI performance. The LC filter (Figure 18) should be placed close to the outputs. The capacitors
used in both the ferrite and LC filters should be grounded to power ground. If both filters are used, the LC
filter should be placed first, following the outputs.
PowerPAD—The PowerPAD must be soldered to the PCB for proper thermal performance and optimal
reliability. The dimensions of the PowerPAD thermal land should be 5 mm by 5 mm (197 mils by 197 mils).
The PowerPAD size measures 4,55 x 4,55 mm. Four rows of solid vias (four vias per row, 0,3302 mm or 13
mils diameter) should be equally spaced underneath the thermal land. The vias should connect to a solid
copper plane, either on an internal layer or on the bottom layer of the PCB. The vias must be solid vias, not
thermal relief or webbed vias. For additional information, see the PowerPAD Thermally Enhanced Package
application note, (SLMA002).
For an example layout, see the TPA3005D2 Evaluation Module (TPA3005D2EVM) User Manual, (SLOU165).
Both the EVM user manual and the PowerPAD application note are available on the TI Web site at
http://www.ti.com.
18
Copyright 2004–2010, Texas Instruments Incorporated
Product Folder Link(s): TPA3005D2
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TPA3005D2PHPR 功能描述:音頻放大器 Stereo Med Power Filter-Free Class-D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA3005D2PHPRG4 功能描述:音頻放大器 Stereo Med Power Filter-Free Class-D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA3007D1 制造商:TI 制造商全稱:Texas Instruments 功能描述:6.5-W MONO CLASS-D AUDIO POWER AMPLIFIER
TPA3007D1_06 制造商:TI 制造商全稱:Texas Instruments 功能描述:6.5-W MONO CLASS-D AUDIO POWER AMPLIFIER
TPA3007D1EVM 功能描述:音頻 IC 開(kāi)發(fā)工具 TPA3007D1 Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類型:Audio Amplifiers 工具用于評(píng)估:TAS5614L 工作電源電壓:12 V to 38 V
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