參數(shù)資料
型號(hào): TPA2100P1YZHT
廠商: TEXAS INSTRUMENTS INC
元件分類(lèi): 音頻/視頻放大
英文描述: 1 CHANNEL, AUDIO AMPLIFIER, PBGA16
封裝: 2.10 X 2.10 MM, GREEN, WCSP-16
文件頁(yè)數(shù): 7/23頁(yè)
文件大?。?/td> 963K
代理商: TPA2100P1YZHT
I
C
1
C =
(2
R
)
f
p
(15)
BOARD LAYOUT
Copper
TraceWidth
Solder
PadWidth
SolderMask
Opening
CopperTrace
Thickness
SolderMask
Thickness
www.ti.com ........................................................................................................................................................................................... SLOS595 – DECEMBER 2008
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 18 and Table 2 shows the appropriate diameters for a
WCSP layout.
Figure 18. Land Pattern Dimensions
Table 2. Land Pattern Dimensions(1) (2) (3) (4)
SOLDER PAD
SOLDER MASK(5)
COPPER
STENCIL(6) (7)
STENCIL
COPPER PAD
DEFINITIONS
OPENING
THICKNESS
OPENING
THICKNESS
Nonsolder mask
275
m × 275 m Sq.
275
m (+0.0, –25 m) 375 m (+0.0, –25 m)
1 oz max (32
m)
125
m thick
defined (NSMD)
(rounded corners)
(1)
Circuit traces from NSMD defined PWB lands should be 75
m to 100 m wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
(2)
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application
(3)
Recommend solder paste is Type 3 or Type 4.
(4)
For a PWB using a Ni/Au surface finish, the gold thickness should be less 0,5 mm to avoid a reduction in thermal fatigue performance.
(5)
Solder mask thickness should be less than 20
m on top of the copper circuit pattern
(6)
Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
(7)
Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
Copyright 2008, Texas Instruments Incorporated
15
Product Folder Link(s): TPA2100P1
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