參數(shù)資料
型號(hào): TPA2054D4AYZKR
廠商: TEXAS INSTRUMENTS INC
元件分類: 音頻/視頻放大
英文描述: 0.94 W, 2 CHANNEL, AUDIO AMPLIFIER, BGA25
封裝: 2.61 X 2.61 MM, GREEN, DSBGA-25
文件頁(yè)數(shù): 16/30頁(yè)
文件大小: 858K
代理商: TPA2054D4AYZKR
C
I
1
f =
(2
R
C )
p
I
C
1
C =
(2
R
f )
p
www.ti.com
SLOS666 – MAY 2010
DECOUPLING CAPACITOR, CS
The TPA2054D4A is a high-performance Class-D audio amplifier that requires adequate power supply
decoupling to ensure the efficiency is high and total harmonic distortion (THD) is low. For higher frequency
transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) 1-mF ceramic
capacitor (typically) placed as close as possible to the device PVDD (L, R) lead works best. Placing this
decoupling capacitor close to the TPA2054D4A is important for the efficiency of the Class-D amplifier, because
any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency.
For filtering lower-frequency noise signals, a 4.7 mF or greater capacitor placed near the audio power amplifier
would also help, but it is not required in most applications because of the high PSRR of this device.
INPUT CAPACITORS, CI
The input capacitors and input resistors form a high-pass filter with the corner frequency, fC, determined in
(1)
The value of the input capacitor is important to consider as it directly affects the bass (low frequency)
performance of the circuit. Speakers in wireless phones cannot usually respond well to low frequencies, so the
corner frequency can be set to block low frequencies in this application. Not using input capacitors can increase
output offset. Equation 2 is used to solve for the input coupling capacitance. If the corner frequency is within the
audio band, the capacitors should have a tolerance of ±10% or better, because any mismatch in capacitance
causes an impedance mismatch at the corner frequency and below.
(2)
BOARD LAYOUT
In making the pad size for the WCSP balls, it is recommended that the layout use non solder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 47 and Table 1 shows the appropriate diameters for a
WCSP layout. The TPA2054D4A evaluation module (EVM) layout is shown in the next section as a layout
example.
Copyright 2010, Texas Instruments Incorporated
23
Product Folder Link(s): TPA2054D4A
相關(guān)PDF資料
PDF描述
TPA2054D4AYZKT 0.94 W, 2 CHANNEL, AUDIO AMPLIFIER, BGA25
TPA2054D4YZKR 0.94 W, 2 CHANNEL, AUDIO AMPLIFIER, BGA25
TPA2054D4YZKT 0.94 W, 2 CHANNEL, AUDIO AMPLIFIER, BGA25
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