參數(shù)資料
型號(hào)： TPA2026D2YZHT
廠商： TEXAS INSTRUMENTS INC
元件分類(lèi)： 音頻／視頻放大
英文描述： AUDIO AMPLIFIER, PBGA16
封裝： 2.20 X 2.20 MM, GREEN, DSBGA-16
文件頁(yè)數(shù)： 26/39頁(yè)
文件大小： 823K
代理商： TPA2026D2YZHT
SLOS649A – MARCH 2010 – REVISED JANUARY 2011
www.ti.com
Figure 47. Land Pattern Dimensions
Table 5. Land Pattern Dimensions(1) (2) (3) (4)
SOLDER PAD
SOLDER MASK(5)
COPPER
STENCIL
COPPER PAD
STENCIL(6) (7) OPENING
DEFINITIONS
OPENING
THICKNESS
275 mm
375 mm
Non solder mask
275 mm × 275 mm Sq. (rounded
1 oz max (32 mm)
125 mm thick
defined (NSMD)
corners)
(+0.0, –25 mm)
(1)
Circuit traces from NSMD defined PWB lands should be 75 mm to 100 mm wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
(2)
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
(3)
Recommend solder paste is Type 3 or Type 4.
(4)
For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.
(5)
Solder mask thickness should be less than 20 mm on top of the copper circuit pattern
(6)
Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
(7)
Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
COMPONENT LOCATION
Place all external components very close to the TPA2026D2. Placing the decoupling capacitor, CS, close to the
TPA2026D2 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace
between the device and the capacitor can cause a loss in efficiency.
TRACE WIDTH
Recommended trace width at the solder balls is 75 mm to 100 mm to prevent solder wicking onto wider PCB
traces. For high current pins (PVDD (L, R), PGND, and audio output pins) of the TPA2026D2, use 100-mm trace
widths at the solder balls and at least 500-mm PCB traces to ensure proper performance and output power for
the device. For the remaining signals of the TPA2026D2, use 75-mm to 100-mm trace widths at the solder balls.
The audio input pins (INR± and INL±) must run side-by-side to maximize common-mode noise cancellation.
32
Copyright 2010–2011, Texas Instruments Incorporated
Product Folder Link(s): TPA2026D2
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