參數(shù)資料
型號(hào)： TPA2012D2RTJ
廠(chǎng)商： Texas Instruments, Inc.
英文描述： 2.1 W/CH STEREO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER
中文描述： 2.1瓦/甲烷立體聲無(wú)濾波器D類(lèi)音頻功率放大器
文件頁(yè)數(shù)： 13/20頁(yè)
文件大?。?/td> 722K
代理商： TPA2012D2RTJ
www.ti.com
BOARD LAYOUT
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width.
Figure 36
and
Table 2
shows the appropriate diameters for a
WCSP layout. The TPA2012D2 evaluation module (EVM) layout is shown in the next section as a layout
example.
Copper
Trace Width
Solder Mask
Thickness
Solder
Pad Width
Solder Mask
Opening
Copper Trace
Thickness
Component Location
TPA2012D2
SLOS438C–DECEMBER 2004–REVISED MARCH 2007
Figure 36. Land Pattern Dimensions
Table 2. Land Pattern Dimensions
(1)(2)(3)(4)
SOLDER PAD
DEFINITIONS
Nonsolder mask
defined (NSMD)
COPPER
PAD
275
μ
m
(+0.0, -25
μ
m)
SOLDER MASK
(5)
OPENING
COPPER
THICKNESS
STENCIL
(6)(7)
OPENING
275
μ
m x 275
μ
m Sq.
(rounded corners)
STENCIL
THICKNESS
375
μ
m (+0.0, -25
μ
m)
1 oz max (32
μ
m)
125
μ
m thick
(1)
Circuit traces from NSMD defined PWB lands should be 75
μ
m to 100
μ
m wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
Recommend solder paste is Type 3 or Type 4.
For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.
Solder mask thickness should be less than 20
μ
m on top of the copper circuit pattern
Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
(2)
(3)
(4)
(5)
(6)
(7)
Place all the external components very close to the TPA2012D2. Placing the decoupling capacitor, C
S
, close to
the TPA2012D2 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace
between the device and the capacitor can cause a loss in efficiency.
13
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPA2012D2RTJR 功能描述:音頻放大器 2.1W Stereo Class-D Aud Power Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA2012D2RTJRG4 功能描述:音頻放大器 2.1W Stereo Class-D Aud Power Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA2012D2RTJT 功能描述:音頻放大器 2.1W Stereo Class-D Aud Power Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA2012D2RTJTG4 功能描述:音頻放大器 2.1W Stereo Class-D Aud Power Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA2012D2YZH 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:2.1 W/CH STEREO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER
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