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參數資料
| 型號： | TPA032D04DCAR |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 運動控制電子 |
| 英文描述： | Dual Audio Amplifier |
| 中文描述： | 雙音頻放大器 |
| 文件頁數： | 22/24頁 |
| 文件大小： | 350K |
| 代理商： | TPA032D04DCAR |
TPA032D04
10-W STEREO CLASS-D AUDIO POWER AMPLIFIER
SLOS203A – DECEMBER 1999 – REVISED MARCH 2000
22
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL INFORMATION
The thermally enhanced DCA package is based on the 56-pin TSSOP, but includes a thermal pad (see Figure 12)
to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface-mount and power have been mutually exclusive terms. A variety of scaled-down TO-220-type
packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,
however, have only two shortcomings: they do not address the very low profile requirements (<2 mm) of many of
today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing
integration. On the other hand, traditional low-power surface-mount packages require power-dissipation derating that
severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and
limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing
technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally
coupled to an external heat dissipator, high power dissipation in the ultra-thin, fine-pitch, surface-mount package can
be reliably achieved.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
Figure 12. Views of Thermally Enhanced DCA Package
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相關代理商/技術參數 |
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|---|---|
| TPA032D04DCARG4 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:10-W STEREO CLASS-D AUDIO POWER AMPLIFIER |
| TPA032D04EVM | 制造商:Texas Instruments 功能描述:EVAL KIT FOR 10-W STEREO CLS-D AUD PWR AMP - Bulk |
| TPA-10 | 功能描述:保險絲 TELPOWER ALARM FUSE RoHS:否 制造商:Littelfuse 產品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風格: 端接類型:SMD/SMT 系列:485 |
| TPA100 | 功能描述:TVS 二極管 - 瞬態(tài)電壓抑制器 100V 50uA Bidirect RoHS:否 制造商:Vishay Semiconductors 極性:Bidirectional 工作電壓: 擊穿電壓:58.9 V 鉗位電壓:77.4 V 峰值浪涌電流:38.8 A 系列: 封裝 / 箱體:DO-214AB 最小工作溫度:- 55 C 最大工作溫度:+ 150 C |
| TPA100RL | 功能描述:TVS 二極管 - 瞬態(tài)電壓抑制器 100V 50uA Bidirect RoHS:否 制造商:Vishay Semiconductors 極性:Bidirectional 工作電壓: 擊穿電壓:58.9 V 鉗位電壓:77.4 V 峰值浪涌電流:38.8 A 系列: 封裝 / 箱體:DO-214AB 最小工作溫度:- 55 C 最大工作溫度:+ 150 C |
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