參數(shù)資料
型號: TPA0233DGQR
廠商: Texas Instruments
文件頁數(shù): 13/26頁
文件大?。?/td> 0K
描述: IC AMP AUDIO PWR 2W MONO 10MSOP
標準包裝: 1
類型: AB 類
輸出類型: 1-通道(單聲道),帶立體聲耳機
在某負載時最大輸出功率 x 通道數(shù)量: 2W x 1 @ 4 歐姆; 92mW x 2 @ 32 歐姆
電源電壓: 2.5 V ~ 5.5 V
特點: 消除爆音;關閉
安裝類型: 表面貼裝
供應商設備封裝: 10-MSOP-PowerPad
封裝/外殼: 10-TFSOP,10-MSOP(0.118",3.00mm 寬)裸露焊盤
包裝: 標準包裝
產(chǎn)品目錄頁面: 876 (CN2011-ZH PDF)
配用: 296-10813-ND - EVAL MOD AUDIO AMP FOR TPA0233
其它名稱: 296-7003-6
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TPA0233DGQ
ACTIVE
MSOP-
Power
PAD
DGQ
10
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPA0233DGQG4
ACTIVE
MSOP-
Power
PAD
DGQ
10
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPA0233DGQR
ACTIVE
MSOP-
Power
PAD
DGQ
10
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPA0233DGQRG4
ACTIVE
MSOP-
Power
PAD
DGQ
10
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
18-Apr-2006
Addendum-Page 1
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