- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382672 > TPA005D14DCA (Texas Instruments, Inc.) 2-W STEREO CLASS-D AUDIO POWER AMPLIFIER PDF資料下載
參數(shù)資料
| 型號： | TPA005D14DCA |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 音頻放大器 |
| 英文描述： | 2-W STEREO CLASS-D AUDIO POWER AMPLIFIER |
| 中文描述： | 2 - W立體聲D類音頻功率放大器 |
| 文件頁數(shù)： | 27/29頁 |
| 文件大?。?/td> | 420K |
| 代理商： | TPA005D14DCA |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁當(dāng)前第27頁第28頁第29頁
TPA005D14
2-W STEREO CLASS-D AUDIO POWER AMPLIFIER
SLOS240A – AUGUST 1999 – REVISED MARCH 2000
27
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL INFORMATION
The thermally enhanced DCA package is based on the 56-pin TSSOP, but includes a thermal pad (see Figure 30)
to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220-type
packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,
however, have only two shortcomings: they do not address the very low profile requirements (<2 mm) of many of
today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing
integration. On the other hand, traditional low-power surface-mount packages require power-dissipation derating that
severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and
limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing
technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally
coupled to an external heat dissipator, high power dissipation in the ultra-thin, fine-pitch, surface-mount package can
be reliably achieved.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
Figure 30. Views of Thermally Enhanced DCA Package
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TPA005D12DCAR | Amplifier. Other |
| TPA005D14DCAR | Amplifier. Other |
| TPA0112PWPR | AUDIO AMPLIFIER|DUAL|CMOS|TSSOP|24PIN|PLASTIC |
| TPA0132PWPR | AUDIO AMPLIFIER|DUAL|CMOS|TSSOP|24PIN|PLASTIC |
| TPA0142PWPR | Dual Audio Amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPA005D14DCAR | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Amplifier. Other |
| TPA00NBNF10 | 制造商:GREATECS 制造商全稱:GREATECS 功能描述:SPST SMT Tactile Switches with LED |
| TPA00NBNG10 | 制造商:GREATECS 制造商全稱:GREATECS 功能描述:SPST SMT Tactile Switches with LED |
| TPA00NBRB10 | 制造商:GREATECS 制造商全稱:GREATECS 功能描述:SPST SMT Tactile Switches with LED |
| TPA00NBRF10 | 制造商:GREATECS 制造商全稱:GREATECS 功能描述:SPST SMT Tactile Switches with LED |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。