參數(shù)資料
型號： TO-263
廠商： HSMC CORP.
英文描述： N-Channel Power Field Effect Transistor
中文描述： N溝道功率場效應晶體管
文件頁數(shù)： 6/6頁
文件大小： 71K
代理商： TO-263
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : MOS200402
Issued Date : 2004.04.01
Revised Date : 2005.03.10
Page No. : 6/6
H06N60U, H06N60E, H06N60F
HSMC Product Specification
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10
o
C~35
o
C Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Profile Feature
Sn-Pb Eutectic Assembly
<3
o
C/sec
Pb-Free Assembly
<3
o
C/sec
Average ramp-up rate (T
L
to T
P
)
Preheat
- Temperature Min (Ts
min
)
- Temperature Max (Ts
max
)
- Time (min to max) (ts)
Tsmax to T
L
- Ramp-up Rate
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Time within 5
o
C of actual Peak
Temperature (t
P
)
Ramp-down Rate
Time 25
o
C to Peak Temperature
100
o
C
150
o
C
60~120 sec
150
o
C
200
o
C
60~180 sec
<3
o
C/sec
<3
o
C/sec
183
o
C
60~150 sec
240
o
C +0/-5
o
C
217
o
C
60~150 sec
260
o
C +0/-5
o
C
10~30 sec
20~40 sec
<6
o
C/sec
<6 minutes
<6
o
C/sec
<8 minutes
3. Flow (wave) soldering (solder dipping)
Products
Peak temperature
245
o
C
±
5
o
C
260
o
C +0/-5
o
C
Dipping time
5sec
±
1sec
5sec
±
1sec
Pb devices.
Pb-Free devices.
Figure 1: Temperature profile
t
P
t
L
Ramp-down
Ramp-up
Ts
max
Ts
min
Critical Zone
T
L
to T
P
t
S
Preheat
T
L
T
P
25
t 25
o
C to Peak
Time
T
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相關代理商/技術(shù)參數(shù)
參數(shù)描述
TO-263-2 制造商:AME 制造商全稱:Analog Microelectronics 功能描述:(D2 PAK) A : MIN 9.65 MAX 10.42 B : MIN 8.28 MAX 9.66
TO-263-3 制造商:AME 制造商全稱:Analog Microelectronics 功能描述:(D2 PAK) A : MIN 9.65 MAX 10.67 B : MIN 8.28 MAX 9.66
TO263-3EV-VREG 功能描述:電源管理IC開發(fā)工具 TO-220-3/ TO263-3 VR Eval Board RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V
TO-263-5 制造商:未知廠家 制造商全稱:未知廠家 功能描述:5-Lead TO-263 Plastic Surface Mount Package
TO263-5 制造商:DIODES 制造商全稱:Diodes Incorporated 功能描述:SUGGESTED PAD LAYOUT
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