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7.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating
Case Temperature (Unless Otherwise Noted)
PARAMETER
TEST CONDITIONS
(1)
3.3-V pins (except
DV
DD33
= MIN,
PCI-capable and I2C
I
OH
pins)
I
= -0.5 mA,
High-level
PCI-capable pins
(2)
V
OH
DV
DD33
= 3.3 V
output voltage
RGMII pins
DDR2 memory
controller pins
3.3-V pins (except
DV
DD33
= MIN,
PCI-capable and I2C
I
OL
pins)
I
= 1.5 mA,
PCI-capable pins
(2)
DV
DD33
= 3.3 V
Low-level output
V
OL
voltage
Pulled up to 3.3 V, 3 mA sink
I2C pins
current
RGMII pins
DDR2 memory
controller pins
V
= V
to DV
, pins
without internal pullup or
pulldown resistor
3.3-V pins (except
PCI-capable and I2C
V
= V
to DV
, pins with
pins)
internal pullup resistor
Input current
I
I(3)
V
= V
to DV
, pins with
[DC]
internal pulldown resistor
I2C pins
0.1DV
DD33
≤
V
I
≤
0.9DV
DD33
PCI-capable pins
(4)
RGMII pins
AECLKOUT,
CLKR1/GP[0],
CLKX1/GP[3],
SYSCLK4/GP[1],
EMU[18:0],
VCLK/CLKR0,
VSCRUN/CLKX0
EMIF pins (except
AECLKOUT), NMI,
TOUT0L, TINP0L,
High-level
TOUT1L, TINP1L,
I
OH
output current
PCI_EN, RESETSTAT,
[DC]
McBSP-capable pins
(except CLKR1/GP[0],
CLKX1/GP[3],
VCLK/CLKR0,
VSCRUN/CLKX0),
GP[7:4], and TDO
PCI-capable pins
(2)
RGMII pins
DDR2 memory
controller pins
TMS320TCI6482
Communications Infrastructure Digital Signal Processor
SPRS246F–APRIL 2005–REVISED MAY 2007
MIN
TYP
MAX
UNIT
0.8DV
DD33
V
0.9DV
DD33
V
DV
DD15
- 0.4
V
1.4
V
0.22DV
DD33
V
0.1DV
DD33
V
0.4
V
0.4
V
0.4
V
-1
1
uA
50
100
400
uA
-400
-100
-50
uA
-10
10
uA
uA
V
-1000
1000
0.4
-8
mA
-4
mA
-0.5
-8
mA
mA
4
mA
(1)
(2)
For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
These rated numbers are from the
PCI Local Bus Specification
(version 2.3). The DC specifications and AC specifications are defined in
Table 4-3 and Table 4-4, respectively, of the
PCI Local Bus Specification
.
I
applies to input-only pins and bi-directional pins. For input-only pins, I
indicates the input leakage current. For bi-directional pins, I
I
includes input leakage current and off-state (hi-Z) output leakage current.
PCI input leakage currents include Hi-Z output leakage for all bidirectional buffers with 3-state outputs.
(3)
(4)
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Device Operating Conditions
101