參數(shù)資料
型號(hào): TMS32C6416DZLZA6E3
廠商: Texas Instruments, Inc.
元件分類: 數(shù)字信號(hào)處理
英文描述: FIXED-POINT DIGITAL SIGNAL PROCESSORS
中文描述: 定點(diǎn)數(shù)字信號(hào)處理器
文件頁數(shù): 133/141頁
文件大?。?/td> 2234K
代理商: TMS32C6416DZLZA6E3
TMS320C6414, TMS320C6415, TMS320C6416
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS146L
FEBRUARY 2001
REVISED JULY 2004
133
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251
1443
MECHANICAL DATA FOR C6414, C6415, AND C6416
The following table(s) show the thermal resistance characteristics for the PBGA — GLZ, ZLZ and CLZ
mechanical packages.
thermal resistance characteristics (S-PBGA package) [GLZ]
NO.
Air Flow (m/s
)
°
C/W
°
C/W
(with Heat Sink
)
1
2
3
4
5
6
R
Θ
JC
R
Θ
JB
R
Θ
JA
R
Θ
JA
R
Θ
JA
R
Θ
JA
Psi
JT
Psi
JB
Junction-to-case
Junction-to-board
Junction-to-free air
Junction-to-free air
Junction-to-free air
Junction-to-free air
N/A
N/A
0.00
0.5
1.0
2.00
1.55
9.1
17.9
15.02
13.4
11.89
1.0
9.0
13.8
8.95
7.35
6.46
7
Junction-to-package top
N/A
0.5
0.5
8
Junction-to-board
N/A
7.4
7.4
m/s = meters per second
These thermal resistance numbers were modeled using a heat sink, part number 374024B00035, manufactured by AAVID Thermalloy. AAVID
Thermalloy also manufactures a similar epoxy-mounted heat sink, part number 374024B00000. When operating at 720 MHz, a heat sink should
be used to reduce the thermal resistance characteristics of the package. TI recommends a passive, laminar heat sink, similar to the part numbers
mentioned above.
thermal resistance characteristics (S-PBGA package) [ZLZ]
NO.
Air Flow (m/s
)
°
C/W
°
C/W
(with Heat Sink
)
1
2
3
4
5
6
R
Θ
JC
R
Θ
JB
R
Θ
JA
R
Θ
JA
R
Θ
JA
R
Θ
JA
Psi
JT
Psi
JB
Junction-to-case
Junction-to-board
Junction-to-free air
Junction-to-free air
Junction-to-free air
Junction-to-free air
N/A
N/A
0.00
0.5
1.0
2.00
1.55
9.1
17.9
15.02
13.4
11.89
1.0
9.0
13.8
8.95
7.35
6.46
7
Junction-to-package top
N/A
0.5
0.5
8
Junction-to-board
N/A
7.4
7.4
m/s = meters per second
These thermal resistance numbers were modeled using a heat sink, part number 374024B00035, manufactured by AAVID Thermalloy. AAVID
Thermalloy also manufactures a similar epoxy-mounted heat sink, part number 374024B00000. When operating at 720 MHz, a heat sink should
be used to reduce the thermal resistance characteristics of the package. TI recommends a passive, laminar heat sink, similar to the part numbers
mentioned above.
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TMS32C6416ECLZW6E3 制造商:Texas Instruments 功能描述:
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TMS32C6416EGLZ6E3 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC Fixed-Point DSP TMS320 Platform RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
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