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參數(shù)資料
| 型號(hào)： | TMP320C40KGD |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 數(shù)字信號(hào)處理 |
| 英文描述： | Floating-Point Digital Signal Processor Known Good Die(具高性能CPU和DMA控制器，6個(gè)通訊口的DSP) |
| 中文描述： | 浮點(diǎn)數(shù)字信號(hào)處理器已知良品裸片（具高性能的CPU和DMA的控制器，6個(gè)通訊口的數(shù)字信號(hào)處理器） |
| 文件頁(yè)數(shù)： | 5/10頁(yè) |
| 文件大?。?/td> | 184K |
| 代理商： | TMP320C40KGD |
TMP320C40KGD, SMJ320C40KGD
FLOATING-POINT DIGITAL SIGNAL PROCESSORS
KNOWN GOOD DIE
SPRS036 – NOVEMBER 1995
5
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
325
244
Die Side Number 4
Pad Number One
1
Die Side Number 1
81
Zero-Zero
(origin)
82
162
Die Side Number 2
243
Die Side Number 3
163
Die Designator
’320C40 (rev 3.3) Known Good Die Pad Information
Figure 2. ’320C40 Die Numbering Format
(See Table 1)
Table 1 provides a reference for the following:
A.
The ’C40 signal identities in relation to the pad numbers
B.
The ’C40 X,Y coordinates, where bond pad 82 serves as the origin (0,0)
In addition, the following notes are significant:
C.
X,Y coordinate data is in microns.
D.
Coordinate origin is at (0,0) (center of bond pad 82).
E.
The active silicon dimensions are 13805.40
μ
m
×
13372.80
μ
m (543.52 mils
×
526.49 mils).
The die size is approximately 13970.00
μ
m
×
13538.2
μ
m (550.00 mils
×
533.00 mils).
Bond pad dimensions are 120.00
μ
m
×
120.00
μ
m (4.72 mils
×
4.72 mils).
Gold bump dimensions are approximately 90
μ
m
×
90
μ
m (3.54 mils
×
3.54 mils).
Center of bond pad to edge of die ranges from 190
μ
m–205
μ
m (7.5 mils–8.1 mils). The range of 15
μ
m
exists since the dicing process will result in some tolerance. Due to the consistency and precision of the
bond pad locations in reference to each other, the center of bond pad 82 was chosen as the origin.
F.
G.
H.
I.
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