參數(shù)資料
型號(hào)： TMP03GBC
廠商： Analog Devices, Inc.
英文描述： Serial Digital Output Thermometers
中文描述： 串行數(shù)字輸出溫度計(jì)
文件頁(yè)數(shù)： 3/16頁(yè)
文件大?。?/td> 375K
代理商： TMP03GBC
TMP03/TMP04
REV. 0
–3–
WAFER TEST LIMITS
Parameter
Symbol
Conditions
Min
Typ
Max
Units
ACCURACY
Temperature Error
Power Supply Rejection Ratio
T
A
= +25
°
C
1
Over Rated Supply
3.0
1.2
°
C
°
C/V
PSRR
OUTPUTS
Output High Voltage, TMP04
Output Low Voltage, TMP04
Output Low Voltage, TMP03
V
OH
V
OL
V
OL
I
OH
= 800
μ
A
I
OL
= 800
μ
A
I
SINK
= 1.6 mA
V+ – 0.4
V
V
V
0.4
0.2
POWER SUPPLY
Supply Range
Supply Current
V+
I
SY
4.5
7
1.3
V
mA
Unloaded
NOTES
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
1
Maximum deviation from ratiometric output transfer function over specified temperature range.
(V+ = +5 V, GND = 0 V, T
A
= +25
8
C, unless otherwise noted)
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the TMP03/TMP04 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*
Maximum Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . +9 V
Maximum Output Current (TMP03 D
OUT
) . . . . . . . . . 50 mA
Maximum Output Current (TMP04 D
OUT
) . . . . . . . . . 10 mA
Maximum Open-Collector Output Voltage (TMP03) . . +18 V
Operating Temperature Range . . . . . . . . . . . –55
°
C to +150
°
C
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . +175
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +160
°
C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300
°
C
*CAUTION
1
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation at or above this specification is not implied. Exposure to the above
maximum rating conditions for extended periods may affect device reliability.
2
Digital inputs and outputs are protected, however, permanent damage may occur
on unprotected units from high-energy electrostatic fields. Keep units in conduc-
tive foam or packaging at all times until ready to use. Use proper antistatic handling
procedures.
3
Remove power before inserting or removing units from their sockets.
Package Type
Θ
JA
Θ
JC
Units
TO-92 (T9)
SO-8 (S)
TSSOP (RU)
162
1
158
1
240
1
120
43
43
°
C/W
°
C/W
°
C/W
NOTE
1
Θ
JA
is specified for device in socket (worst case conditions).
DICE CHARACTERISTICS
Die Size 0.050
×
0.060 inch, 3,000 sq. mils
( 1.27
×
1.52 mm, 1.93 sq. mm)
For additional DICE ordering information, refer to databook.
ORDERING GUIDE
Accuracy
at +25
8
C
Temperature
Range
Model
Package
TMP03FT9
TMP03FS
TMP03FRU
TMP03GBC
TMP04FT9
TMP04FS
TMP04FRU
TMP04GBC
±
3.0
±
3.0
±
3.0
±
3.0
±
3.0
±
3.0
±
3.0
±
3.0
XIND
XIND
XIND
+25
°
C
XIND
XIND
XIND
+25
°
C
TO-92
SO-8
TSSOP-8
Die
TO-92
SO-8
TSSOP-8
Die
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